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S2KA

更新时间: 2024-10-30 14:51:55
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SMD

S2KA 数据手册

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®
S2AA – S2MA  
2.0A SURFACE MOUNT GLASS PASSIVATED STANDARD DIODE  
WON-TOP ELECTRONICS  
Features  
Glass Passivated Die Construction  
Ideally Suited for Automatic Assembly  
Low Forward Voltage Drop  
Surge Overload Rating to 60A Peak  
Low Power Loss  
Built-in Strain Relief  
Plastic Case Material has UL Flammability  
Classification Rating 94V-0  
B
D
A
F
C
H
G
E
SMA/DO-214AC  
Min  
Mechanical Data  
Dim  
A
Max  
2.92  
4.60  
1.90  
0.305  
5.30  
2.44  
0.203  
1.52  
Case: SMA/DO-214AC, Molded Plastic  
Terminals: Solder Plated, Solderable  
per MIL-STD-750, Method 2026  
2.29  
B
4.00  
C
1.27  
Polarity: Cathode Band or Cathode Notch  
Marking: Type Number  
Weight: 0.064 grams (approx.)  
Lead Free: For RoHS / Lead Free Version,  
Add “-LF” Suffix to Part Number, See Page 4  
D
0.152  
4.80  
E
F
2.00  
G
H
0.051  
0.76  
All Dimensions in mm  
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified  
Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.  
Characteristic  
Symbol  
S2AA S2BA S2DA S2GA S2JA S2KA S2MA Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
VRRM  
VRWM  
VR  
50  
35  
100  
70  
200  
140  
400  
600  
420  
800  
560  
1000  
700  
V
RMS Reverse Voltage  
VR(RMS)  
IO  
280  
2.0  
V
A
Average Rectified Output Current  
@TL = 110°C  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single Half Sine-Wave Superimposed on  
Rated Load (JEDEC Method)  
IFSM  
60  
A
V
Forward Voltage  
@IF = 2.0A  
VFM  
IRM  
CJ  
1.1  
Peak Reverse Current  
@TA = 25°C  
5.0  
200  
µA  
pF  
At Rated DC Blocking Voltage  
@TA = 125°C  
Typical Junction Capacitance (Note 1)  
30  
Typical Thermal Resistance (Note 2)  
Typical Thermal Resistance (Note 3)  
RθJA  
RθJL  
75  
20  
°C/W  
°C  
Operating and Storage Temperature Range  
TJ, TSTG  
-65 to +150  
Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.  
2. Junction to ambient, device mounted on PCB with 8.0mm x 8.0mm copper pads.  
3. Junction to lead, device mounted on PCB with 8.0mm x 8.0mm copper pads.  
© Won-Top Electronics Co., Ltd.  
Revision: September, 2012  
www.wontop.com  
1

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