S2AW THRU S2MW
RFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER
SU
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere
FEATURES
SOD-123FL
Cathode Band
Top View
Glass passivated device
Ideal for surface mouted applications
Low reverse leakage
Metallurgically bonded construction
High temperature soldering guaranteed:
2.8±0.1
250 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
0.6±0.25
MECHANICAL DATA
Case: JEDEC SOD-123FL molded plastic body over passivated chip
Terminals: Solderable per MIL-STD-750,
Method 2026
3.7±0.2
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0007 ounce, 0.02 grams
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SYMBOLS
S2BW S2DW
S2AW
2D1
S2GW S2JW S2KW
S2MW
2D7
UNITS
MDD Catalog
2D2
100
70
2D3
200
140
200
2D4
400
280
400
2D5
600
420
600
2D6
800
560
800
Number
Maximum repetitive peak reverse voltage
Maximum RMS voltage
1000 VOLTS
VOLTS
50
35
50
VRRM
VRMS
VDC
700
100
1000 VOLTS
Maximum DC blocking voltage
Maximum average forward rectified current
at TA=65 C (NOTE 1)
I(AV)
2.0
Amp
Peak forward surge current
IFSM
50
8.3ms single half sine-wave superimposed on
Amps
Volts
rated load (JEDEC Method)
TL=25 C
VF
IR
1.1
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
10.0
50.0
µ
A
TA=125 C
Typical junction capacitance (NOTE 2)
CJ
RθJA
pF
°C/W
C
30
90
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
TJ,TSTG
-55 to +150
Note:
1.Averaged over any 20ms period.
2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.Thermal resistance from junction to ambient at 0.375” (9.5mm)lead length,P.C.B. mounted