S2JBFL THRU S2MBFL
Features
• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates
Compliant. See Ordering Information)
2.0 Amp
• Glass Passivated Chip Junction
• Low Profile Package
• For Surface Mount Applications
• High Forward Surge Capability
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
Glass Passivated
Silicon Rectifier
600 to 1000 Volts
• Halogen Free. “Green” Device (Note 2)
Maximum Ratings
• Operating Junction Temperature Range: -55⁰C to +150⁰C
• Storage Temperature Range: -55⁰C to +150⁰C
SMBF
C
• Typical Thermal Resistance(Note 3): 15°C/W Junction to Case
• Typical Thermal Resistance(Note 3): 20°C/W Junction to Lead
• Typical Thermal Resistance(Note 3): 60°C/W Junction to Ambient
Cathode Mark
B
A
Maximum
Maximum DC
Maximum
RMS
Voltage
MCC
Device
Recurrent
Peak Reverse
Voltage
Blocking
Voltage
Part Number
Marking
F
S2JBFL
S2MBFL
S2J
S2M
600V
1000V
420V
700V
600V
1000V
E
Electrical Characteristics @ 25°C Unless Otherwise Specified
G
Average Forward
Current
D
IF(AV)
IFSM
2.0A
TL=105⁰C
DIMENSIONS
MM
MIN MAX MIN MAX
50A
100A
8.3ms,Half-sine Wave
1ms,Square Wave
Peak Forward Surge
Current
INCHES
DIM
NOTE
A
B
C
D
E
F
0.134 0.150 3.40 3.80
0.075 0.083 1.90 2.10
0.163 0.175 4.15 4.45
0.201 0.220 5.10 5.60
0.041 0.061 1.05 1.55
0.028 0.053 0.70 1.35
0.006 0.010 0.15 0.25
Maximum
Instantaneous
Forward Voltage
IF=2.0A;
1.1V
VF
TJ=25⁰C*
Maximum DC Reverse
Current At Rated DC
Blocking Voltage
5μA
TJ=25⁰C;
TJ=125⁰C
IR
100μA
G
Suggested Solder Pad Layout
Typical Junction
Capacitance
Measured at 1.0MHz
VR=4.0V
CJ
12pF
*Pulse Test: Pulse Width 300 μsec, Duty Cycle 2%
Note:
2.2mm
4.3mm
1. High Temperature Solder Exemptions Applied, See EU Directive Annex 7a.
2. Halogen free "Green"products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
3. Mounted on P.C.B. with 0.3" x 0.3" (8.0 mm x 8.0 mm) copper pad areas.
1.9mm
Rev.3-1-10012021
1/3
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