5秒后页面跳转
捷配首页

Datasheet > S29GL256M11FFIR2
S29GL256M11FFIR2 PDF预览

S29GL256M11FFIR2

更新时间： 2024-01-09 02:25:18
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
156页 4377K
描述
Flash, 16MX16, 110ns, PBGA64,

阅读下载

中文翻译

获取价格

S29GL256M11FFIR2 技术参数

是否Rohs认证： 符合生命周期：Transferred
包装说明：BGA, BGA64,8X8,40Reach Compliance Code：unknown
风险等级：5.8最长访问时间：110 ns
备用内存宽度：8命令用户界面：YES
通用闪存接口：YES数据轮询：YES
JESD-30 代码：S-PBGA-B64JESD-609代码：e1
内存密度：268435456 bit内存集成电路类型：FLASH
内存宽度：16湿度敏感等级：3
部门数/规模：512端子数量：64
字数：16777216 words字数代码：16000000
最高工作温度：85 °C最低工作温度：-40 °C
组织：16MX16封装主体材料：PLASTIC/EPOXY
封装代码：BGA封装等效代码：BGA64,8X8,40
封装形状：SQUARE封装形式：GRID ARRAY
页面大小：4/8 words并行/串行：PARALLEL
电源：3.3 V认证状态：Not Qualified
就绪/忙碌：YES部门规模：64K
最大待机电流：0.000005 A子类别：Flash Memories
最大压摆率：0.06 mA标称供电电压 (Vsup)：3.3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式：BALL端子节距：1 mm
端子位置：BOTTOM切换位：YES
类型：NOR TYPEBase Number Matches：1

S29GL256M11FFIR2 数据手册

 浏览型号S29GL256M11FFIR2的Datasheet PDF文件第2页浏览型号S29GL256M11FFIR2的Datasheet PDF文件第3页浏览型号S29GL256M11FFIR2的Datasheet PDF文件第4页浏览型号S29GL256M11FFIR2的Datasheet PDF文件第5页浏览型号S29GL256M11FFIR2的Datasheet PDF文件第6页浏览型号S29GL256M11FFIR2的Datasheet PDF文件第7页 
S29GLxxxM MirrorBitTM Flash Family  
S29GL256M, S29GL128M, S29GL064M, S29GL032M  
256 Megabit, 128 Megabit, 64 Megabit, and 32Megabit,  
3.0 Volt-only Page Mode Flash Memory featuring  
0.23 um MirrorBit process technology  
Datasheet  
PRELIMINARY  
Distinctive Characteristics  
— 16-word/32-byte write buffer reduces overall  
programming time for multiple-word updates  
Low power consumption (typical values at 3.0 V, 5  
MHz)  
— 18 mA typical active read current (64 Mb, 32 Mb)  
— 25 mA typical active read current (256 Mb, 128 Mb)  
— 50 mA typical erase/program current  
— 1 µA typical standby mode current  
Architectural Advantages  
„
„
„
Single power supply operation  
— 3 volt read, erase, and program operations  
„
„
Manufactured on 0.23 um MirrorBit process  
technology  
SecSi™ (Secured Silicon) Sector region  
— 128-word/256-byte sector for permanent, secure  
identification through an 8-word/16-byte random  
Electronic Serial Number, accessible through a  
command sequence  
Package options  
— 40-pin TSOP  
— 48-pin TSOP  
— 56-pin TSOP  
— 64-ball Fortified BGA  
— 48-ball fine-pitch BGA  
— 63-ball fine-pitch BGA  
— May be programmed and locked at the factory or by  
the customer  
„
Flexible sector architecture  
— 256Mb: 512 32 Kword (64 Kbyte) sectors  
— 128Mb: 256 32 Kword (64 Kbyte) sectors  
Software & Hardware Features  
— 64Mb (uniform sector modules): 128 32 Kword (64  
Kbyte) sectors or 128 32 Kword sectors  
„
Software features  
— Program Suspend & Resume: read other sectors  
before programming operation is completed  
— Erase Suspend & Resume: read/program other  
sectors before an erase operation is completed  
— Data# polling & toggle bits provide status  
— CFI (Common Flash Interface) compliant: allows host  
system to identify and accommodate multiple flash  
devices  
— 64Mb (boot sector models): 127 32 Kword (64 Kbyte)  
sectors + 8 4Kword (8Kbyte) boot sectors  
— 32Mb (uniform sector models): 64 32Kword (64  
Kbyte) sectors of 64 32Kword sectors  
— 32Mb (boot sector models): 63 32Kword (64 Kbyte)  
sectors + 8 4Kword (8Kbyte) boot sectors  
„
Compatibility with JEDEC standards  
— Provides pinout and software compatibility for single-  
power supply flash, and superior inadvertent write  
protection  
— Unlock Bypass Program command reduces overall  
multiple-word programming time  
„
Hardware features  
— Sector Group Protection: hardware-level method of  
preventing write operations within a sector group  
„
„
100,000 erase cycles typical per sector  
20-year data retention typical  
— Temporary Sector Unprotect: V -level method of  
ID  
charging code in locked sectors  
Performance Characteristics  
— WP#/ACC input accelerates programming time  
(when high voltage is applied) for greater throughput  
during system production. Protects first or last sector  
regardless of sector protection settings  
— Hardware reset input (RESET#) resets device  
— Ready/Busy# output (RY/BY#) detects program or  
erase cycle completion  
„
High performance  
— 90 ns access time (128Mb, 64Mb, 32Mb),  
100 ns access time (256Mb)  
— 4-word/8-byte page read buffer  
— 25 ns page read times (128Mb, 64Mb, 32Mb)  
— 30 ns page read times (256Mb)  
— 16-word/32-byte write buffer  
Publication Number S29GLxxxM_00 Revision A Amendment 3 Issue Date February 26, 2004  
1234567...156

中文翻译

下载PDF

与S29GL256M11FFIR2相关器件

型号 品牌 获取价格 描述 数据表
S29GL256M11FFIR22 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PBGA64, 18 X 12 MM, LEAD FREE, FORTIFIED, BGA-64
S29GL256M11TAIR1 SPANSION

获取价格

 		Flash
S29GL256M11TAIR12 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56, MO-142-EC, TSOP-56
S29GL256M11TAIR13 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56, MO-142EC, TSOP-56
S29GL256M11TAIR2 SPANSION

获取价格

 		Flash
S29GL256M11TAIR22 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56, MO-142-EC, TSOP-56
S29GL256M11TAIR23 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56, MO-142EC, TSOP-56
S29GL256M11TFIR1 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56,
S29GL256M11TFIR10 SPANSION

获取价格

 		Flash, 16MX16, 110ns, PDSO56, LEAD FREE, MO-142EC, TSOP-56
S29GL256M11TFIR2 CYPRESS

获取价格

 		Flash, 16MX16, 110ns, PDSO56, TSOP-56

与S29GL256M11FFIR2相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证