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S29CD032G0PQAN03 PDF预览

S29CD032G0PQAN03

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
78页 1239K
描述
Flash, 1MX32, 54ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80

S29CD032G0PQAN03 数据手册

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S29CD-G Flash Family  
S29CD032G, S29CD016G  
32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit)  
2.5 Volt-only Burst Mode, Dual Boot,  
Simultaneous Read/Write Flash Memory  
with VersatileI/O™ featuring 170 nm Process Technology  
Data Sheet (Preliminary)  
Distinctive Characteristics  
– Standby mode: CMOS: 60 µA max  
Architecture Advantages  
„ Simultaneous Read/Write Operations  
„ 1 million write cycles per sector typical  
„ 20 year data retention typical  
– Read data from one bank while executing erase/program functions  
in other bank  
„ VersatileI/O™ Control  
– Zero latency between read and write operations  
Two bank architecture: large bank/small bank 75% / 25%  
– Generates data output voltages and tolerates data input voltages as  
determined by the voltage on the V pin  
IO  
– 1.65 V to 3.60 V compatible I/O signals  
„ User-Defined x32 Data Bus  
„ Dual Boot Block  
Software Features  
Top and bottom boot sectors in the same device  
„ Persistent Sector Protection  
„ Flexible Sector Architecture  
– Locks combinations of individual sectors and sector groups to  
prevent program or erase operations within that sector (requires  
– CD032G: Eight 2K Double Word, Sixty-two 16K Double Word, and  
Eight 2K Double Word sectors  
– CD016G: Eight 2K Double Word, Thirty-two 16K Double Word, and  
Eight 2K Double Word sectors  
only V levels)  
CC  
„ Password Sector Protection  
– Locks combinations of individual sectors and sector groups to  
prevent program or erase operations within that sector using a user-  
definable 64-bit password  
„ Secured Silicon Sector (256 Bytes)  
Factory locked and identifiable: 16 bytes for secure, random factory  
Electronic Serial Number; Also know as Electronic Marking  
„ Supports Common Flash Interface (CFI)  
„ Unlock Bypass Program Command  
„ Manufactured on 170 nm Process Technology  
„ Programmable Burst Interface  
– Reduces overall programming time when issuing multiple program  
command sequences  
– Interfaces to any high performance processor  
– Linear Burst Read Operation: 2, 4, and 8 double word linear burst  
with or without wrap around  
„ Data# Polling and Toggle Bits  
– Provides a software method of detecting program or erase operation  
completion  
„ Program Operation  
– Performs synchronous and asynchronous write operations of burst  
configuration register settings independently  
Hardware Features  
„ Single Power Supply Operation  
„ Program Suspend/Resume & Erase Suspend/Resume  
– Optimized for 2.5 to 2.75 volt read, erase, and program operations  
– Suspends program or erase operations to allow reading,  
programming, or erasing in same bank  
„ Compatibility with JEDEC standards (JC42.4)  
– Software compatible with single-power supply Flash  
– Backward-compatible with AMD/Fujitsu Am29LV/MBM29LV and  
Am29F/MBM29F flash memories  
„ Hardware Reset (RESET#), Ready/Busy# (RY/BY#), and Write  
Protect (WP#) Inputs  
„ ACC Input  
– Accelerates programming time for higher throughput during system  
production  
Performance Characteristics  
„ High Performance Read Access  
„ Package Options  
– 80-pin PQFP  
– Initial/random access times of 48 ns (32 Mb) and 54 ns (16 Mb)  
– Burst access times of 7.5 ns (32 Mb) or 9 ns (16Mb)  
– 80-ball Fortified BGA  
– Pb-free package option also available  
– Known Good Die  
„ Ultra Low Power Consumption  
– Burst Mode Read: 90 mA @ 75 MHz max  
– Program/Erase: 50 mA max  
Publication Number S29CD-G_00  
Revision B  
Amendment 0  
Issue Date November 14, 2005  
This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qual-  
ification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document  
may be revised by subsequent versions or modifications due to changes in technical specifications.  

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