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S29AL016M10FFI012 PDF预览

S29AL016M10FFI012

更新时间: 2024-02-18 09:21:07
品牌 Logo 应用领域
飞索 - SPANSION 闪存存储内存集成电路
页数 文件大小 规格书
59页 2056K
描述
16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY

S29AL016M10FFI012 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:13 X 11 MM, LEAD FREE, FBGA-64
针数:64Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.69Is Samacsys:N
最长访问时间:100 ns其他特性:TOP BOOT BLOCK
备用内存宽度:8启动块:TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:13 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1部门数/规模:1,2,1,31
端子数量:64字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA64,8X8,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.4 mm部门规模:16K,8K,32K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.06 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
切换位:YES类型:NOR TYPE
宽度:11 mmBase Number Matches:1

S29AL016M10FFI012 数据手册

 浏览型号S29AL016M10FFI012的Datasheet PDF文件第2页浏览型号S29AL016M10FFI012的Datasheet PDF文件第3页浏览型号S29AL016M10FFI012的Datasheet PDF文件第4页浏览型号S29AL016M10FFI012的Datasheet PDF文件第5页浏览型号S29AL016M10FFI012的Datasheet PDF文件第6页浏览型号S29AL016M10FFI012的Datasheet PDF文件第7页 
S29AL016M  
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)  
3.0 Volt-only Boot Sector Flash Memory  
featuring MirrorBitTM technology  
DATASHEET  
Data Sheet  
Distinctive Characteristics  
Architectural Advantages  
— 400 nA standby mode current  
— 15 mA read current  
„
„
„
Single power supply operation  
— 3 V for read, erase, and program operations  
— 40 mA program/erase current  
— 400 nA Automatic Sleep mode current  
Manufactured on 0.23 µm MirrorBitTM process  
technology  
SecSiTM (Secured Silicon) Sector region  
— 128-word/256-byte sector for permanent, secure  
identification through an 8-word/16-byte random  
Electronic Serial Number, accessible through a  
command sequence  
„
Package options  
— 48-ball Fine-pitch BGA  
— 64-ball Fortified BGA  
— 48-pin TSOP  
Software Features  
— May be programmed and locked at the factory or by  
the customer  
— Program Suspend & Resume: read other sectors  
before programming operation is completed  
— Erase Suspend & Resume: read/program other  
sectors before an erase operation is completed  
— Data# polling & toggle bits provide status  
— Unlock Bypass Program command reduces overall  
multiple-word programming time  
— CFI (Common Flash Interface) compliant: allows host  
system to identify and accommodate multiple flash  
devices  
„
„
Flexible sector architecture  
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-  
one 64 Kbyte sectors (byte mode)  
— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-  
one 32 Kword sectors (word mode)  
Compatibility with JEDEC standards  
— Provides pinout and software compatibility for single-  
power supply flash, and superior inadvertent write  
protection  
Hardware Features  
„
„
„
Top or bottom boot block configurations available  
100,000 erase cycle typical per sector  
20-year typical data retention  
— Sector Protection: hardware-level method of  
preventing write operations within a sector  
Temporary Sector Unprotect: VID-level method of  
changing code in locked sectors  
Performance Characteristics  
— Hardware reset input (RESET#) resets device  
— Ready/Busy# output (RY/BY#) indicates program or  
erase cycle completion  
„
High performance  
— 90 ns access time  
— 0.7 s typical sector erase time  
„
Low power consumption (typical values at 5 MHz)  
Publication Number S29AL016M_00 Revision A Amendment 4 Issue Date April 21, 2004  

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