生命周期: | Obsolete | 零件包装代码: | BCC |
包装说明: | VBCC, LCC32,.2SQ,20 | 针数: | 32 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | JESD-30 代码: | S-XBCC-B32 |
长度: | 5 mm | 功能数量: | 1 |
端子数量: | 32 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VBCC | 封装等效代码: | LCC32,.2SQ,20 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, VERY THIN PROFILE |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Other Telecom ICs |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | BICMOS | 电信集成电路类型: | BASEBAND CIRCUIT |
温度等级: | OTHER | 端子形式: | BUTT |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S1M8673X01-V0T0 | SAMSUNG |
获取价格 |
RF and Baseband Circuit, BICMOS, PDSO20, ETSSOP-20 | |
S1M8674X01-G0T0 | SAMSUNG |
获取价格 |
RF and Baseband Circuit, BICMOS, PQCC24, 3.50 X 4.50 MM, EXPOSED PAD, QFN-24 | |
S1M8674X01-V0T0 | SAMSUNG |
获取价格 |
RF and Baseband Circuit, BICMOS, PDSO20, ETSSOP-20 | |
S1M8821 | SAMSUNG |
获取价格 |
INTERGER RF/IF DUAL PLL | |
S1M8821X01-R0T0 | SAMSUNG |
获取价格 |
INTERGER RF/IF DUAL PLL | |
S1M8821X01-R0T0(20TSSOP) | SAMSUNG |
获取价格 |
PLL/Frequency Synthesis Circuit, BICMOS, PDSO20 | |
S1M8821X01-R0T0(24QFN) | SAMSUNG |
获取价格 |
PLL/Frequency Synthesis Circuit, BICMOS, PQCC24 | |
S1M8822 | SAMSUNG |
获取价格 |
INTERGER RF/IF DUAL PLL | |
S1M8822X01-R0T0 | SAMSUNG |
获取价格 |
INTERGER RF/IF DUAL PLL | |
S1M8822X01-R0T0(20TSSOP) | SAMSUNG |
获取价格 |
PLL/Frequency Synthesis Circuit, BICMOS, PDSO20 |