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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| S172156220 | ETC |
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| S172156380 | ETC |
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|
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| S172156400 | ETC |
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|
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| S172156415 | ETC |
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|
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| S-1721A1212-I6T1G | SII |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
| S-1721A1212-I6T1U | ABLIC |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
| S-1721A1212-M6T1G | SII |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
| S-1721A1212-M6T1X | ABLIC |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
| S-1721A1215-I6T1G | SII |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
| S-1721A1215-I6T1U | ABLIC |
获取价格 |
SUPER-SMALL PACKAGE 2-CIRCUIT HIGH RIPPLE-REJECTION LOW CURRENT CONSUMPTION LOW DROPOUT CM |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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意法半导体发布第四代SiC技术，助力电动汽车电驱
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