Datasheet > S0603F1.5

S0603F1.5

更新时间： 2022-02-26 09:11:34

品牌	Logo	应用领域
固锝 - GOOD-ARK		/
页数	文件大小	规格书
4页	169K
描述
Chip Fuse

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数据手册

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S0603F1.5 数据手册

Chip Fuse

Description

S0603F Series

■

Fast acting for excessive current

Compatible with reflow and wave solder

Rugged ceramic and glass construction

Excellent environmental performance

RoHS Compliant ,Lead Free & Halogen Free

material

OVERCOAT

Sn PLATING

Applications

■

Telecommunication: PDA / DSL/ Cell Phones

Computers: LCD Panel / Printers/ Laptop/

Servers

Cu / Ni PLATING

FUSE ELEMENT

CERAMIC SUBSTRATE

■

Consumer Electronics: DVD player / MP3

MP4 Player

Environmental Data

■

Life Test: MIL-STD-202, Method 108A

Humidity Bias: MIL-STD-202 , Method 103

Moisture Resistance Test: MIL-STD-202, Method 106G

Thermal Shock: MIL-STD-202, Method 107G

Terminal Strength: AEC-Q200-006

Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)

Vibration: MIL-STD-202, Method 204D

Mechanical Shock:MIL-STD-202,Method 213B

Solderability: MIL-STD-202 Method 208H

Resistance to Solder Heat: MIL-STD-202,Method 210A

Electrical Characteristics

Ampere Rating

% of Amp Rating

Opening Time

250mA-6A

100%

4 Hours Minimum

250mA-6A

250%

5 Seconds Maximum

Electrical Specifications

Voltage Interrupting Resistance

Typical

Voltage

Drop

(V)****

1.3

Alpha

Product

Code

Current

Rating

Rating*

(ohms)**

Typ.

Melt I²t ***

DC (A²s)

Code

Marking

AC DC

AC/DC

*****

S0603F250

S0603F375

S0603F500

250mA

375mA

500mA

32V 32V

50A

5.1

2.4

1.1

0.0004

0.0009

0.0018

0.93

0.66

@copyright Good-Ark2012

www.goodark.com

12 3 4

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