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ROK101007/2 PDF预览

ROK101007/2

更新时间: 2024-11-24 21:13:27
品牌 Logo 应用领域
爱立信 - ERICSSON 电信电信集成电路
页数 文件大小 规格书
12页 628K
描述
Telecom Circuit, 1-Func

ROK101007/2 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.19JESD-30 代码:R-XXMA-X
功能数量:1最高工作温度:75 °C
最低工作温度:封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified标称供电电压:3.3 V
表面贴装:NO电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL EXTENDED端子形式:UNSPECIFIED
端子位置:UNSPECIFIEDBase Number Matches:1

ROK101007/2 数据手册

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ROK 101 007  
Bluetooth  
Multi Chip Module  
Key Features  
• Pre-qualified Bluetooth 1.1 Module  
• Multi Point Operation, 7 slaves  
• RF output power class 2  
• FCC and ETSI approved  
• Multiple interfaces for different  
applications  
• UART for data (HCI interface)  
• PCM for voice  
• USB for voice and data (HCI interface)  
• I2C interface for controlling of external  
I2C devices  
• Internal crystal oscillator  
• HCI firmware over USB and UART  
included  
Description  
ROK 101 007 is a module for implementing  
therefore requires no PC resources. ROK 101 007,  
which is compliant with Bluetooth version 1.1, is  
a Class 2 Bluetooth Module (0 dBm) and is type-  
approved. The module supports all Bluetooth profiles.  
Bluetooth functionality into various electronic devices.  
The module consists of three major parts; a baseband  
controller, a flash memory and a radio that operates in  
the globally available 2.4 – 2.5 GHz free ISM band.  
Both data and voice transmission is supported by the  
module. Communication between the module and the  
host controller is carried out using a full-speed USB  
interface compliant with USB Specification 2.0 or a  
UART/PCM interface. When using the USB interface,  
the module appears as a USB slave device and  
Suggested Applications  
Computers and peripherals  
Handheld devices and accessories  
Access points  
The Bluetooth trademarks are owned by Bluetooth SIG, Inc., U.S.A.  
e

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