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BU1511KV2 PDF预览

BU1511KV2

更新时间: 2024-02-04 02:13:17
品牌 Logo 应用领域
罗姆 - ROHM 微控制器和处理器外围集成电路uCs集成电路uPs集成电路
页数 文件大小 规格书
5页 155K
描述
Silicon monolithic integrated circuit

BU1511KV2 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:LFQFP, QFP144,.87SQ,20
针数:144Reach Compliance Code:compliant
HTS代码:8542.31.00.01风险等级:5.61
JESD-30 代码:S-PQFP-G144JESD-609代码:e2
长度:20 mm端子数量:144
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP144,.87SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH电源:1.5,2.85,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
子类别:Microprocessors最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Copper (Sn/Cu)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD宽度:20 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUITBase Number Matches:1

BU1511KV2 数据手册

 浏览型号BU1511KV2的Datasheet PDF文件第2页浏览型号BU1511KV2的Datasheet PDF文件第3页浏览型号BU1511KV2的Datasheet PDF文件第4页浏览型号BU1511KV2的Datasheet PDF文件第5页 
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Structure  
Product Name  
Type  
Silicon monolithic integrated circuit  
System LSI for Event data recorder  
BU1511KV2  
Function  
BU1511KV2 is a system LSI for event data recorder that makes developing it easier  
BU1511KV2 have built-in specific hardware to communicate and control with a 3-axis  
accelerometer and a camera module, SD card, etc. that are recommended for event data  
recorder.  
The specific hardware are controllerable by built-in ARM946E-S, which can execute various  
applications.  
The following function blocks are built-in.  
ARM946E-S  
External Memory Interface  
Interrupt Controller  
Timer/Timer Counter  
GPIO(16ch, PWM 4ch(shared), IRQ 4ch(shared)) UART(2ch)  
SD Card Interface/SD Card Controller  
SSI(Synchronous Serial Interface)  
Watch Dog Timer  
I2C Master Controller  
Camera Interface (up to 2M pixels)  
JPEG Codec  
ADPCM Audio Codec with IIS Interface  
TV Encoder(within 75driver)  
Clock Controller/PLL  
A/D Converter(4ch)  
Absolute maximum ratings  
Parameter  
Symbol  
DAVDD  
Rating  
Unit  
V
Parameter  
Symbol  
VIN1  
VIN2  
VIN3  
VIN4  
VIN5  
VIN6  
Tstg  
Rating  
Unit  
V
Power supply voltage 1 (DAC)  
Power supply voltage 2 (ADC)  
Power supply voltage 3 (I2C-1)  
Power supply voltage 4 (I2C-2)  
Power supply voltage 5 (SD-CARD)  
Power supply voltage 6(CAMERA)  
Power supply voltage 7(Other IO)  
-0.3+4.2  
Input voltageADC)  
Input voltageI2C-1)  
Input voltageI2C-2)  
Input voltageSD-CARD)  
Input voltageCAMERA)  
Input voltageOther IO)  
Storage temperature range  
Power dissipation  
-0.3ADVDD+0.3  
-0.3I1VDD+0.3  
-0.3I2VDD+0.3  
-0.3SDVDD+0.3  
-0.3CAVDD+0.3  
-0.3IOVDD+0.3  
-40+150  
ADVDD -0.3+4.2  
V
V
I1VDD  
I2VDD  
-0.3+4.2  
-0.3+4.2  
V
V
V
V
SDVDD -0.3+4.2  
V
V
CAVDD  
IOVDD  
-0.3+4.2  
-0.3+4.2  
-0.3+2.1  
V
V
V
ºC  
mW  
Power supply voltage 8(Digital CORE) DVDD  
V
PD  
1200*1, 1700*2  
*1 IC only. In the case of exceeding 25C, 12.0 mW should be reduced at the rating 1C.  
*2 When packaging a glass epoxy board of 270x70x1.6mm. If exceeding 25ºC, 17mW should be reduced at the rating 1ºC.  
Has not been designed to withstand radiation.  
*
Because this product is specifically designed for a particular device or unit, check in advance if the device or unit is a strategic material stated in the Foreign  
Exchange law.  
Be careful of handling this document because contents of this document may fall under the service (technology in the design, the manufacture and the use)  
defined in the Foreign Exchange and Foreign Trade Control law of Japan.  
REV.C  

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