RMK48N10KCP

更新时间： 2024-11-20 06:08:23

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
3页	107K
描述
Bare Chip Resistor Network

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数据手册

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RMK48N10KCP 数据手册

RMK 408N, 508N, 48N, 816N, 914N (CN)

Vishay Sfernice

Bare Chip Resistor Network

FEATURES

• High precision tolerances down to 0.01 % Ratio

• Very low temperature coefficient: 10 ppm/°C abs.,

2 ppm/°C ratio

• Excellent stability < 300 ppm, 2000 h at Pn at

+ 70 °C

Actual Size

• Wirebondable

TYPICAL PERFORMANCE

Manufactured in ULTRAFILM technology, these resistor

network chips have a high level of integration, wide ohmic

value range, very low temperature coefficient 10 ppm/°C

which are unequaled on the market today. Laser trimming

can provide excellent precision down to 0.1 % abs 0.01 %

ratio.

ABS

5 ppm/°C

ABS

TRACKING

TCR

TOL.

1 ppm/°C

RATIO

0.1 %

0.01 %

SCHEMATIC

0.2

13 12 11 10

R₁R₂R₃R₄

RMK 408N

0.24

0.1

R₂

R₅R₆R₇

R₁

R₈

RMK 816N

0.13

R₃R₄

0.2

R₂

R₁

R₄

R₃

R₅

RMK 508N

13 12 11 10

R₄R₆

0.24

R₈

R₇

R₂

R₉

RMK 914N

0.4

R₃

R₃R₅

0.13

R₄

R₁

RMK 48N

R₂

R₁

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

CONDITION

SERIES

48N, 408N, 508N, 816N, 914N

Tracking

Absolute

Ratio

1 ppm/°C typical/ 2 ppm/°C maximum

10 ppm/°C maximum/ 5 ppm/°C maximum

0.05 %, 0.02 %, 0.01 %

1.0 %, 0.5 %, 0.25 %, 0.1 %

48N = 125 mW, others: 250 mW

48N = 50 mW, others: 125 mW

< 300 ppm

- 55 °C to + 125 °C

TCR:

- 55 °C to + 125 °C/0 °C to + 70 °C

Tolerance:

Absolute

at + 70 °C

at + 125 °C

Power rating:

(0 W at + 155 °C)

Stability

2000 h at + 70 °C under Pn

Voltage coefficient

Working voltage

< 0.1 ppm/V

100 V

Operating temperature range

Storage temperature range

Noise

- 55 °C to + 155 °C ⁽¹⁾

+ 70 °C

< - 35 dB

Thermal EMF

0.01 µV/°C

Shelf life stability

50 ppm

1 year at + 25 °C

Note:

⁽¹⁾For 200 °C operations please consult factory

* Please see document “Vishay Green and Halogen-Free Definitions (5-2008)” http://www.vishay.com/doc?99902

www.vishay.com

For technical questions, contact: sfer@vishay.com

Document Number: 60053

Revision: 06-Oct-08

12 3

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