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RM35N30DN PDF预览

RM35N30DN

更新时间: 2024-06-27 12:12:55
品牌 Logo 应用领域
RECTRON
页数 文件大小 规格书
7页 521K
描述
Vdss (V) : 30 V;Id @ 25C (A) : 35.0 A;Rds-on (typ) (mOhms) : 4.8 mOhms;Total Gate Charge (nQ) typ : 19 nQ;Maximum Power Dissipation (W) : 35 W;Vgs(th) (typ) : 0.85 V;Input Capacitance (Ciss) : 1265 pF;Polarity : N-Channel;Mounting Style : SMD/SMT;Package / Case : DFN

RM35N30DN 数据手册

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RM35N30DN  
N-Channel Enhancement Mode Power MOSFET  
Description  
The RM35N30DN uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate charge. It  
can be used in a wide variety of applications.  
General Features  
ƽ VDS =30V,ID =35A  
Schematic diagram  
RDS(ON) < 5.5mΩ @ VGS=10V  
RDS(ON) < 9.5mΩ @ VGS=4.5V  
35N30  
XXXX  
ƽ High density cell design for ultra low Rdson  
ƽ Fully characterized avalanche voltage and current  
ƽ Good stability and uniformity with high EAS  
ƽ Excellent package for good heat dissipation  
ƽ Special process technology for high ESD capability  
Marking and pin assignment  
Application  
ƽ Secondary side synchronous rectifier  
ƽ High side switch in POL DC/DC converter  
Halogen-free  
DFN 3x3 EP top view  
100% UIS TESTED!  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
35N30  
RM35N30DN  
DFN 3x3 EP  
-  
-
-ꢀ  
Absolute Maximum Ratings (TC=25ćunless otherwise noted)  
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
V
V
VDS  
VGS  
ID  
Gate-Source Voltage  
±20  
Drain Current-Continuous  
Pulsed Drain Current  
35  
120  
A
A
IDM  
PD  
Maximum Power Dissipation  
35  
W
Derating factor  
0.28  
W/ć  
mJ  
ć
Single pulse avalanche energy (Note 5)  
Operating Junction and Storage Temperature Range  
EAS  
150  
-55 To 150  
TJ,TSTG  
2018-08/17  
REV:A  

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