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RM30P55LD PDF预览

RM30P55LD

更新时间: 2024-11-18 18:09:35
品牌 Logo 应用领域
RECTRON
页数 文件大小 规格书
7页 504K
描述
Vdss (V) : 55 V;Id @ 25C (A) : 30 A;Rds-on (typ) (mOhms) : 40 mOhms;Total Gate Charge (nQ) typ : 56 nQ;Maximum Power Dissipation (W) : 65 W;Vgs(th) (typ) : 1.6 V;Input Capacitance (Ciss) : 3500 pF;Polarity : P-Channel;Mounting Style : SMD/SMT;Package / Case : TO-252(D-PAK)

RM30P55LD 数据手册

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RM30P55LD  
P-Channel Enhancement Mode Power MOSFET  
Description  
The RM30P55LD uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate charge. It  
can be used in a wide variety of applications.  
General Features  
ƽ VDS =-55V,ID =-30A  
Schematic diagram  
RDS(ON) <40mΩ @ VGS=-10V  
ƽ High density cell design for ultra low Rdson  
ƽ Fully characterized avalanche voltage and current  
ƽ Good stability and uniformity with high EAS  
ƽ Excellent package for good heat dissipation  
Marking and pin assignment  
Application  
ƽꢀ Power switching application  
ƽꢀ Hard switched and high frequency circuits  
ƽꢀ Uninterruptible power supply  
Halogen-free  
D
100% UIS TESTED!  
G
S
TO-252-2L top view  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
RM30P55LD  
TO-252-2L  
-  
-
-ꢀ  
30P55  
Absolute Maximum Ratings (TC=25ćunless otherwise noted)  
Parameter  
Symbol  
VDS  
Limit  
-55  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current-Continuous  
20  
V
VGS  
-30  
-21  
A
ID  
Drain Current-Continuous(TC=100ć)  
Pulsed Drain Current  
ID (100ć)  
A
110  
A
IDM  
Maximum Power Dissipation  
65  
W
PD  
Derating factor  
Single pulse avalanche energy(Note 5)  
0.43  
W/ć  
mJ  
ć
EAS  
420  
Operating Junction and Storage Temperature Range  
-55 To 175  
TJ,TSTG  
Thermal Characteristic  
Thermal Resistance,Junction-to-Case(Note 2)  
RθJC  
2.3  
ć/W  
2019-01/15  
REV:A  

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