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RM30N100LD PDF预览

RM30N100LD

更新时间: 2024-06-27 12:13:35
品牌 Logo 应用领域
RECTRON
页数 文件大小 规格书
7页 499K
描述
Vdss (V) : 100 V;Id @ 25C (A) : 30 A;Rds-on (typ) (mOhms) : 31 mOhms;Total Gate Charge (nQ) typ :

RM30N100LD 数据手册

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RM30N100LD  
N-Channel Enhancement Mode Power MOSFET  
Description  
The RM30N100LD uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate charge. It  
can be used in a wide variety of applications.  
General Features  
ƽ VDS = 100V,ID =30A  
Schematic diagram  
RDS(ON) < 50mΩ @ VGS=10V (Typ:40mΩ)  
RDS(ON) < 60mΩ @ VGS=5V (Typ:50mΩ)  
ƽ Special process technology for high ESD capability  
ƽ High density cell design for ultra low Rdson  
ƽ Fully characterized avalanche voltage and current  
ƽ Good stability and uniformity with high EAS  
ƽ Excellent package for good heat dissipation  
Halogen-free  
P/N suffix V means AEC-Q101 qualified, e.g:RM30N100LDV  
Marking and pin assignment  
Application  
ƽ Power switching application  
ƽ Hard switched and high frequency circuits  
ƽ Uninterruptible power supply  
100% UIS TESTED!  
TO-252 -2Ltop view  
100% ∆Vds TESTED!  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
30N100  
RM30N100LD  
TO-252-2L  
-  
-
-ꢀ  
Absolute Maximum Ratings (TC=25ćunless otherwise noted)  
Symbol  
VDS  
Parameter  
Limit  
100  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current-Continuous  
20  
V
VGS  
30  
21  
A
ID  
ID (100ć)  
Drain Current-Continuous(TC=100ć)  
Pulsed Drain Current  
A
70  
A
IDM  
Maximum Power Dissipation  
85  
W
PD  
Derating factor  
Single pulse avalanche energy(Note 5)  
0.57  
256  
W/ć  
mJ  
ć
EAS  
Operating Junction and Storage Temperature Range  
-55 To 175  
TJ,TSTG  
2020-07/15  
REV:C  

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