Intel StrataFlash® Wireless Memory
(L30)
28F640L30, 28F128L30, 28F256L30
Datasheet
Product Features
■ High performance Read-While-Write/Erase
— 85 ns initial access
■ Security
— OTP space:
• 64 unique factory device identifier bits
• 64 user-programmable OTP bits
— 52 MHz with zero wait state, 17 ns clock-to-
data output synchronous-burst mode
— 25 ns asynchronous-page mode
— 4-, 8-, 16-, and continuous-word burst mode
— Burst suspend
— Programmable WAIT configuration
— Buffered Enhanced Factory Programming
(BEFP) at 5 µs/byte (Typ)
• Additional 2048 user-programmable OTP bits
— Absolute write protection: VPP = GND
— Power-transition erase/program lockout
— Individual zero-latency block locking
— Individual block lock-down
■ Software
— 1.8 V low-power buffered programming at
— 20 µs (Typ) program suspend
7 µs/byte (Typ)
— 20 µs (Typ) erase suspend
■ Architecture
— Intel® Flash Data Integrator (FDI) optimized
— Basic Command Set (BCS) and Extended
Command Set (ECS) compatible
— Asymmetrically-blocked architecture
— Multiple 8-Mbit partitions: 64-Mbit and 128-
Mbit devices
— Common Flash Interface (CFI) capable
— Multiple 16-Mbit partitions: 256-Mbit devices
— Four 16-Kword parameter blocks: top or
bottom configurations
■ Quality and Reliability
— Expanded temperature: –25° C to +85° C
— Minimum 100,000 erase cycles per block
— ETOX™ VIII process technology (0.13 µm)
■ Density and Packaging
— 64-Kword main blocks
— Dual-operation: Read-While-Write (RWW) or
Read-While-Erase (RWE)
— 64-, 128-, and 256-Mbit density in VF BGA
packages
— 128/0 and 256/0 Density in Stacked-CSP
— 16-bit wide data bus
— Status register for partition and device status
■ Power
— VCC (core) = 1.7 V - 2.0 V
— VCCQ (I/O) = 2.2 V - 3.3 V
— Standby current: 30 µA (Typ) for 256-Mbit
— 4-Word synchronous read current: 16 mA (Typ)
at 52 MHz
— Automatic Power Savings mode
The Intel StrataFlash® wireless memory (L30) product is the latest generation of Intel
StrataFlash® memory devices featuring flexible, multiple-partition, dual operation. It provides
high performance synchronous-burst read mode and asynchronous read mode using 1.8 V low-
voltage, multi-level cell (MLC) technology.
The multiple-partition architecture enables background programming or erasing to occur in one
partition while code execution or data reads take place in another partition. This dual-operation
architecture also allows a system to interleave code operations while program and erase
operations take place in the background.
The L30 device is manufactured using Intel® 0.13 µm ETOX™ VIII process technology. It is
available in industry-standard chip scale packaging.
Order Number: 251903, Revision: 008
January 2005