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RD38F4060L0YBB0 PDF预览

RD38F4060L0YBB0

更新时间: 2024-11-09 07:49:39
品牌 Logo 应用领域
恒忆 - NUMONYX 动态存储器内存集成电路
页数 文件大小 规格书
48页 865K
描述
Memory Circuit, Flash+SDRAM, PBGA103,

RD38F4060L0YBB0 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:FBGA, BGA103,9X12,32Reach Compliance Code:unknown
风险等级:5.77最长访问时间:70 ns
JESD-30 代码:R-PBGA-B103内存集成电路类型:MEMORY CIRCUIT
混合内存类型:FLASH+SDRAM端子数量:103
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA103,9X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH电源:1.8 V
认证状态:Not Qualified最大待机电流:0.00002 A
子类别:Other Memory ICs最大压摆率:0.08 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOMBase Number Matches:1

RD38F4060L0YBB0 数据手册

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®
Numonyx™ StrataFlash Wireless Memory  
(L18)  
512-Mbit LX Family with LPSDRAM (x16)  
Datasheet  
Product Features  
„ Device Architecture  
„ Flash Performance  
— Flash die density: 128- or 256-Mbit  
— LPSDRAM die density: 128- or 256-Mbit  
— Async SRAM die density: 8-Mbit  
— 85 ns Asynchronous single-word read  
— 25 ns Asynchronous four-word page read  
— 14 ns Synchronous read (tCHQV  
)
Top, Bottom or Dual flash parameter  
configuration  
„ Device Voltage  
— 54 MHz CLK  
— Buffered Enhanced Factory Programming: 5  
µs/byte (typ.) per die  
— Core: VCC = 1.8 V (Typ)  
— I/O: VCCQ = 1.8 V (Typ)  
„ Device Packaging  
— Ball count: 103 Active balls  
— Area: 9x11 mm  
— Height: 1.2 mm to 1.4 mm  
„ SDRAM Architecture and Performance  
— Clock rate: 104 MHz  
— Four internal banks  
— Burst length: 1, 2, 4, 8 or full page  
„ SRAM Performance  
— 70 ns initial access at 1.8 V I/O  
„ Quality and Reliability  
— Buffered programming at 7 µs/byte (typ.)  
per die  
„ Flash Architecture  
— Hardware Read-While-Write/Erase  
— Asymmetrical blocking structure  
— 8-Mbit or 16-Mbit partition size  
— 16-KWord parameter blocks (Top or  
Bottom); 64-KWord main blocks  
— 2-Kbit One-Time Programmable (OTP)  
Protection Register  
— Zero-latency block locking  
— Absolute write protection with block lock-  
down using F-VPP and F-WP#  
„ Flash Software  
— Extended Temperature –25 °C to +85 °C  
— Minimum 100K Flash Block Erase cycles  
— 0.13 µm ETOX™ VIII Process  
— Numonyx™ FDI, Numonyx™ PSM and  
Numonyx™ VFM  
— Common Flash Interface (CFI)  
— Basic/Extended Command Set  
317623-15  
November 2007  

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