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RC48F2000W0YC00 PDF预览

RC48F2000W0YC00

更新时间: 2024-11-05 08:07:59
品牌 Logo 应用领域
恒忆 - NUMONYX 内存集成电路闪存
页数 文件大小 规格书
90页 1196K
描述
Flash, 4MX16, 60ns, PBGA44,

RC48F2000W0YC00 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:FBGA, BGA44,8X14,20Reach Compliance Code:unknown
风险等级:5.88最长访问时间:60 ns
启动块:BOTTOM命令用户界面:YES
通用闪存接口:YES数据轮询:NO
JESD-30 代码:R-PBGA-B44内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:16
部门数/规模:8,127端子数量:44
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA44,8X14,20
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
页面大小:4 words并行/串行:PARALLEL
电源:1.8 V认证状态:Not Qualified
部门规模:4K,32K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.04 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM切换位:NO
类型:NOR TYPEBase Number Matches:1

RC48F2000W0YC00 数据手册

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Numonyx™ Wireless Flash Memory (W18)  
with AD Multiplexed IO  
Datasheet  
Product Features  
„ High Performance Read-While-Write/Erase  
— Burst frequency at 66 MHz  
„ Security  
— 128 bit Protection Register  
— 64 Unique Bits Programmed by Numonyx  
— 64 User-Programmable Bits  
— Absolute Write Protection with VPP at  
Ground  
— Individual and Instantaneous Block  
Locking/Unlocking with Lock-Down  
Capability  
— 60 ns Initial Access Read Speed  
— 11 ns Burst-Mode Read Speed  
— 20 ns Page-Mode Read Speed  
— 4-, 8-, 16-, and Continuous-Word Burst  
Mode Reads  
— Burst and Page Mode Reads in all Blocks,  
across all partition boundaries  
— Burst Suspend Feature  
„ Software  
— 5 µs (typ.) Program and Erase Suspend  
Latency Time  
— Enhanced Factory Programming at  
3.1 µs/word (typ. for 0.13 µm)  
— Numonyx™ Flash Data Integrator  
(Numonyx™ FDI) and Common Flash  
Interface Compatible  
„ Architecture  
— Multiple 4 Mbit Partitions  
— Dual Operation: Read-while-Write and  
Read-while-Erase  
— 8 KB parameter blocks  
— 64 KB main blocks  
Top or Bottom Parameter Configurations  
— 16 bit wide data bus  
— Programmable WAIT Signal Polarity  
„ Quality and Reliability  
Temperature Range: –40 °C to +85 °C  
— 100k Erase Cycles per Block  
— 130 nm ETOX™ VIII Process  
— 90 nm ETOX™ IX Process  
— Multiplexed Address data bus  
„ Power  
„ Density and Package Ballout  
— 130 nm: 32-, 64-, and 128-Mbit  
— 90 nm: 32-, 64-Mbit  
— VCC = 1.70 V to 1.95 V  
— VCCQ = 1.70 V to 2.24 V or 1.35 V to 1.80 V  
— Standby current (0.13 µm): 8 µA (typ.)  
— Read current: 7 mA (typ.)  
— 44-ball VF BGA  
— 88-ball QUAD+  
Order Number: 313272-06  
November 2007  

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