是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA-64 |
针数: | 64 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.53 | 最长访问时间: | 85 ns |
其他特性: | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 启动块: | TOP |
JESD-30 代码: | R-PBGA-B64 | JESD-609代码: | e0 |
长度: | 10 mm | 内存密度: | 268435456 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 64 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 235 |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.3 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
类型: | NOR TYPE | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
RC28F256P33TF | NUMONYX |
获取价格 |
Flash, 16MX16, 95ns, PBGA64, BGA-64 | |
RC28F256P33TFA | MICRON |
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2.3V to 3.6V VCC (core) voltage, 2.3V to 3.6V VCCQ (I/O) voltage | |
RC28F256P33TFE | MICRON |
获取价格 |
2.3V to 3.6V VCC (core) voltage, 2.3V to 3.6V VCCQ (I/O) voltage | |
RC28F320C3 | INTEL |
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3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY | |
RC28F320C3BA100 | INTEL |
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Advanced+ Boot Block Flash Memory (C3) | |
RC28F320C3BA110 | INTEL |
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Advanced+ Boot Block Flash Memory (C3) | |
RC28F320C3BA70 | INTEL |
获取价格 |
Advanced+ Boot Block Flash Memory (C3) | |
RC28F320C3BC70 | INTEL |
获取价格 |
Advanced+ Boot Block Flash Memory (C3) | |
RC28F320C3BC90 | INTEL |
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Advanced+ Boot Block Flash Memory (C3) | |
RC28F320C3BD70 | INTEL |
获取价格 |
Advanced+ Boot Block Flash Memory (C3) |