是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | PGA | 包装说明: | IPGA, SPGA370,37X37 |
针数: | 370 | Reach Compliance Code: | compliant |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.75 | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 100 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CPGA-P370 | JESD-609代码: | e4 |
长度: | 49.53 mm | 低功率模式: | YES |
端子数量: | 370 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | IPGA | 封装等效代码: | SPGA370,37X37 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, INTERSTITIAL PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 1.7 V |
认证状态: | Not Qualified | 座面最大高度: | 4.759 mm |
速度: | 850 MHz | 子类别: | Microprocessors |
标称供电电压: | 1.7 V | 表面贴装: | NO |
技术: | CMOS | 端子面层: | NICKEL PALLADIUM GOLD |
端子形式: | PIN/PEG | 端子节距: | 2.54 mm |
端子位置: | PERPENDICULAR | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 49.53 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
RB80526PY850256 | INTEL |
功能相似 |
Microprocessor, 32-Bit, 850MHz, CMOS, CPGA370, FCPGA-370 |
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