Datasheet > RABS2_17

RABS2_17

更新时间： 2024-11-19 01:22:03

品牌	Logo	应用领域
辰达行 - MDD		快速恢复二极管
页数	文件大小	规格书
2页	321K
描述
GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS

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中文翻译

获取价格

数据手册

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RABS2_17 数据手册

RABS2 THRU RABS10

GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS

Voltage Range - 200 to 1000 Volts Current - 0.8/1.0 Ampere

FEATURES

ABS

Ideal for printed circuit board

Reliable low cost construction utilizing

molded plastic technique

High temperature soldering guaranteed:

260 / 10 seconds at 5 lbs., (2.3kg) tension

Small size, simple installation

Leads solderable per MIL-STD-202,

Method 208

High surge current capability

Glass passivated chip junction

Green compound(halogen&Sb2O3 free)

MECHANICAL DATA

Case: Molded plastic body

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: Polarity symbols marked on case

Mounting Position: Any

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.

SYMBOLS

UNITS

RABS2

RABS4

RABS6

RABS8

RABS10

MDD Catalog

Number

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Maximum DC blocking voltage

Maximum average forward rectified current

On glass-epoxy P.C.B.(Note1)

On aluminum substrate(Note2)

Peak forward surge current,

1000

IF(AV)

IFSM

0.8

1.0

8.3ms single half sine-wave superimposed on

rated load

Maximum instantaneous forward voltage drop

per leg at 0.4A

1.3

Maximum DC reverse current

at rated DC blocking voltage

TA=25

5.0

500

TA=125

R JL

R JA

Typical thermal resistance(NOTE 3)

Maximum reverse recovery time

(NOTE 4)

trr

150

250

500

Operating temperature range

storage temperature range

-55 to +150

TSTG

NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.

2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.

3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)

4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.

copper pads.

中文翻译

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