Datasheet > RABS156

RABS156

更新时间： 2024-02-07 22:07:35

品牌	Logo	应用领域
辰达行 - MDD		快速恢复二极管
页数	文件大小	规格书
2页	367K
描述
GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS

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中文翻译

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数据手册

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RABS156 数据手册

RABS152 THRU RABS1510

GLASS PASSIVATED FAST RECOVERY BRIDGE RECTIFIERS

Voltage Range - 200 to 1000 Volts Current - 1.5 Ampere

FEATURES

ABS

Ideal for printed circuit board

Reliable low cost construction utilizing

molded plastic technique

High temperature soldering guaranteed:

260 / 10 seconds at 5 lbs., (2.3kg) tension

Small size, simple installation

Leads solderable per MIL-STD-202,

Method 208

High surge current capability

Glass passivated chip junction

Green compound(halogen&Sb2O3 free)

MECHANICAL DATA

Case: Molded plastic body

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: Polarity symbols marked on case

Mounting Position: Any

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.

SYMBOLS

MDD Catalog

MDD Mark

RABS152 RABS154 RABS156

RABS158 RABS1510

Number

UNITS

F15T02

F15T04

F15T06

F15T08

F15T10

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Maximum DC blocking voltage

1000

Maximum average forward rectified current

at Tc=125°C

IF(AV)

IFSM

1.5

Peak forward surge current,

8.3ms single half sine-wave superimposed on

rated load

Maximum instantaneous forward voltage drop

per leg at 1.5A

1.3

Maximum DC reverse current

at rated DC blocking voltage

TA=25

5.0

TA=125

100

R JL

R JA

Typical thermal resistance(NOTE 3)

Typical Junction Capacitance

C_j

trr

Maximum reverse recovery time

Operating temperature range

(NOTE 4)

200

T^J,TSTG

-55 to +150

NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.

2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.

3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)

4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.

copper pads.

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