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R5F104AGASP#V0 PDF预览

R5F104AGASP#V0

更新时间: 2024-11-20 15:49:11
品牌 Logo 应用领域
瑞萨 - RENESAS 时钟微控制器光电二极管外围集成电路
页数 文件大小 规格书
222页 2692K
描述
R5F104AGASP#V0

R5F104AGASP#V0 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:LSSOP
包装说明:LSSOP, SSOP30,.3针数:30
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:8.13具有ADC:YES
其他特性:ALSO OPERATES AT 1.6 V MINIMUM SUPPLY AT 4 MHZ地址总线宽度:
位大小:16CPU系列:RL78
最大时钟频率:20 MHzDAC 通道:YES
DMA 通道:NO外部数据总线宽度:
JESD-30 代码:R-PDSO-G30长度:9.85 mm
I/O 线路数量:26端子数量:30
片上程序ROM宽度:8最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LSSOP
封装等效代码:SSOP30,.3封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8/5 V认证状态:Not Qualified
RAM(字节):16384ROM(单词):131072
ROM可编程性:FLASH座面最大高度:1.4 mm
速度:32 MHz子类别:Microcontrollers
最大压摆率:8.7 mA最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.1 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

R5F104AGASP#V0 数据手册

 浏览型号R5F104AGASP#V0的Datasheet PDF文件第2页浏览型号R5F104AGASP#V0的Datasheet PDF文件第3页浏览型号R5F104AGASP#V0的Datasheet PDF文件第4页浏览型号R5F104AGASP#V0的Datasheet PDF文件第5页浏览型号R5F104AGASP#V0的Datasheet PDF文件第6页浏览型号R5F104AGASP#V0的Datasheet PDF文件第7页 
Datasheet  
R01DS0053EJ0331  
Rev. 3.31  
RL78/G14  
RENESAS MCU  
Feb 14, 2020  
True low-power platform (66 μA/MHz, and 0.60 μA for operation with only RTC and LVD) for the general-purpose  
applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 44 DMIPS at 32 MHz  
1. OUTLINE  
1.1  
Features  
Ultra-Low Power Consumption Technology  
• VDD = single power supply voltage of 1.6 to 5.5 V which  
can operate a 1.8 V device at a low voltage  
• HALT mode  
• STOP mode  
• SNOOZE mode  
Event Link Controller (ELC)  
• Event signals of 19 to 26 types can be linked to the  
specified peripheral function.  
Serial Interfaces  
• CSI: 3 to 8 channels  
• UART/UART (LIN-bus supported): 3 or 4 channels  
• I2C/simplified I2C: 3 to 8 channels  
RL78 CPU Core  
• CISC architecture with 3-stage pipeline  
• Minimum instruction execution time: Can be changed  
from high speed (0.03125 s: @ 32 MHz operation with  
high-speed on-chip oscillator) to ultra-low speed (30.5  
s: @ 32.768 kHz operation with subsystem clock)  
• Multiply/divide/multiply & accumulate instructions are  
supported.  
• Address space: 1 MB  
• General-purpose registers: (8-bit register 8) 4 banks  
• On-chip RAM: 2.5 to 48 KB  
Timer  
• 16-bit timer: 8 to 12 channels  
(Timer Array Unit (TAU): 4 to 8 channels, Timer RJ: 1  
channel, Timer RD: 2 channels, Timer RG: 1 channel)  
• 12-bit interval timer: 1 channel  
• Real-time clock: 1 channel (calendar for 99 years, alarm  
function, and clock correction function)  
• Watchdog timer: 1 channel (operable with the dedicated  
low-speed on-chip oscillator)  
A/D Converter  
Code Flash Memory  
• 8/10-bit resolution A/D converter (VDD = 1.6 to 5.5 V)  
• Analog input: 8 to 20 channels  
• Internal reference voltage (1.45 V) and temperature  
sensor  
• Code flash memory: 16 to 512 KB  
• Block size: 1 KB  
• Prohibition of block erase and rewriting (security  
function)  
D/A Converter  
• On-chip debug function  
• 8-bit resolution D/A converter (VDD = 1.6 to 5.5 V)  
• Analog output: None or up to two channels  
• Output voltage: 0 V to VDD  
• Self-programming (with boot swap function/flash shield  
window function)  
Data Flash Memory  
• Real-time output function  
• Data flash memory: 4 KB and 8 KB  
• Back ground operation (BGO): Instructions can be  
executed from the program memory while rewriting the  
data flash memory.  
• Number of rewrites: 1,000,000 times (TYP.)  
• Voltage of rewrites: VDD = 1.8 to 5.5 V  
Comparator  
• None or up to two channels  
• Operating modes: Comparator high-speed mode,  
comparator low-speed mode, window mode  
• The external reference voltage or internal reference  
voltage can be selected as the reference voltage.  
High-speed On-chip Oscillator  
• Select from 64 MHz, 48 MHz, 32 MHz, 24 MHz, 16 MHz,  
12 MHz, 8 MHz, 6 MHz, 4 MHz, 3 MHz, 2 MHz, and  
1 MHz  
• High accuracy: ±1.0% (VDD = 1.8 to 5.5 V, TA = -20 to  
+85°C)  
I/O Port  
• I/O port: 26 to 92 (N-ch open drain I/O [withstand  
voltage of 6 V]: 2 to 4, N-ch open drain I/O [VDD  
withstand voltage/EVDD withstand voltage]: 10 to 28)  
• Can be set to N-ch open drain, TTL input buffer, and on-  
chip pull-up resistor  
Operating Ambient Temperature  
• TA = -40 to +85°C (A: Consumer applications, D:  
Industrial applications)  
• Different potential interface: Can connect to a 1.8/2.5/3  
V device  
• On-chip key interrupt function  
• TA = -40 to +105°C (G: Industrial applications)  
• On-chip clock output/buzzer output controller  
Power Management and Reset Function  
• On-chip power-on-reset (POR) circuit  
• On-chip voltage detector (LVD) (Select interrupt and  
reset from 14 levels)  
Others  
• On-chip BCD (binary-coded decimal) correction circuit  
Remark  
The functions mounted depend on the product.  
See 1.6 Outline of Functions.  
Data Transfer Controller (DTC)  
• Transfer modes: Normal transfer mode, repeat transfer  
mode, block transfer mode  
• Activation sources: Activated by interrupt sources.  
• Chain transfer function  
R01DS0053EJ0331 Rev. 3.31  
Feb 14, 2020  
Page 1 of 217  

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