Datasheet > R-2400

R-2400

更新时间： 2024-11-27 11:15:15

品牌	Logo	应用领域
松下 - PANASONIC		/
页数	文件大小	规格书
2页	546K
描述
高热传导性多层基板用薄膜

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R-2400 数据手册

Thermal conductivity

2.7W/m・K*

Excellent resin flowability

R-2400

High-thermal conductive film

for multi-layer circuit board

RTI 150℃

* Measured with the laser flash method

High-thermal conductivity of 2.7 W/m・K* helps reduce the

number of thermal management components. The excellent

resin flowability enables multilayering of electronic circuit

boards, contributing to the miniaturization of equipment.

Certified to meet the UL-specified rated temperature of 150℃

and can be used in high-temperature environment.

A^Apu^plt^ico^atm^iono^stive

Vehicle chargers, Power supplies for railroads,

Power conditioners for photovoltaic power

generation, Inverters, Step-up converters, etc.

Conventional materials

^{Superiority of R-2400ꢀMiniaturization of circuit boards by multilayering}R^(c-^r2^os4^s0^-s0^{ectional view)}

Excellent resin ﬂowability achieves superior circuit

Insuﬃcient resin ﬂowability makes circuit ﬁlling diﬃcult.

Multilayering of circuit boards is not possible because

insulating layers cannot be formed.

ﬁlling properties.

Multilayering of circuit boards is possible because

insulating layers can be formed satisfactorily.

Power

<Double-sided circuit board>

semiconductor

Conventional

materials*

Conventional

materials*

Heat sink

Power

R-2400

semiconductor

Conventional

Circuit board

materials*

miniaturization

by multilayering

Heat sink

Circuits are not ﬁlled (Generation of voids)

*Conventional materials: High thermal conductive materials

Circuits are ﬁlled

*Conventional materials: High thermal conductive materials

●Example of copper

●

Component-embedded applications

Product line-up(Thickness)

100μm, 150μm

pattern embedding

It is expected to apply R-2400's

excellent resin

Cu thickness : 105um

ﬂowability

to component-embedded circuit boards.

Film thickness : 100um x 2ply

R-2400

R-1566

Power

semiconductor

Heat sink

R-2400

200.00μm

Please refer to the reverse side for "Comparison of thermal conductivity" and "General properties".

中文翻译

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