Datasheet > QSC6270

QSC6270

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
高通 - QUALCOMM		/
页数	文件大小	规格书
4页	680K
描述
Single-Chip Solution

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QSC6270 数据手册

Q U A L C O M M C H I P S E T S O L U T I O N S

CONVERGENCE

ENHANCED MULTIMEDIA

MULTIMEDIA

VALUE

QSC6270™ Single-Chip Solution

Mainstream mobile broadband expands globally with industry’s first

single-chip solution for HSDPA and WCDMA (UMTS) networks

The QSC6270^™solution will help drive the rapid adoption of high-speed mobile broadband around the world as

the world’s first single-chip solution supporting HSDPA/WCDMA (UMTS) and GSM/GPRS/EDGE networks. A complete

system solution with integrated video, audio, graphics and multimedia capabilities, the QSC6270 solution enables

sleek, must-have devices that reflect smart design without compromising on power and functionality.

As part of the QUALCOMM Single-Chip (QSC) family, the QSC6270 solution integrates four functions that typically

require separate ICs—baseband modem, RF transceiver, power management, and multimedia processor—into a single

chip. This unsurpassed level of integration offers device manufacturers the benefits of lower bill-of-material (BOM) costs,

significant board-area savings, and simplified design for shorter time-to-market. Manufacturers who use QSC solutions

can offer devices with smaller, sleeker form-factors that offer a wide range of in-demand features at lower price points—

all with significant power savings. Stylish designs with broadband data rates and compelling wireless multimedia

capabilities ranging from 3.0 megapixel camera for album-quality snapshots, easy-to-use MP3 tunes and more, can

now be available in the mass-market tier.

MOBILE BROADBAND SPEEDS IN A SINGLE-CHIP SOLUTION TO DRIVE THE RAPID DEVELOPMENT

AND ADOPTION OF HIGH-SPEED WIRELESS DATA AND MULTIMEDIA APPLICATIONS

P E R F O R M A N C E

• QVM^™Java^®environment platform with

multitasking virtual machine (MVM) and ARM’s

Jazelle^™Java acceleration speeds execution

of multiple, concurrent games and applets

Maximize design and development potential

• Air interfaces supported:

- HSDPA 3.6 Mbps peak rate category

5/6 + Equalizer

- WCDMA (UMTS) R99

- GSM Release 4

• Enhanced memory support for NAND

and SDRAM

- GPRS/EGPRS Multislot Class 12, Release 4

- DTM Multislot Class 11

- GPS

• Advanced 0.5 mm pitch CSP packaging

technology

• Integrated secure boot, secure software

and secure storage

• Open BREWapi^™software to run uiOne^™and

BREW applications

• High-performance 184 MHz ARM926EJ-S^™

microprocessor core with memory

management unit (MMU)

• QDSP4000^™high-performance digital signal

processors (DSP)

12 3 4

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与QSC6270相关器件

型号	品牌	描述	获取价格	数据表
QSCA	TTELEC	Surface mount QSOP resistor network, 24 pin, isolated, GUS-QS	获取价格
QSCB	TTELEC	Surface mount QSOP resistor network, 24 pin, bussed, GUS-QS	获取价格
QSCM	RALSTON	Nitrogen Calibration Manifolds	获取价格
QSCM-0000-0-0	RALSTON	QSCM manifold only, no gauge adapter, no hoses, no process connections, no bag	获取价格
QSCM-1MSA-20-2	RALSTON	QSCM manifold	获取价格
QSCM-2FSA-20-2	RALSTON	QSCM manifold	获取价格