REVISION V
QTE-XXX-01-XXX-D-DP-EMX-XX
OPTION
No OF POSITIONS
DO NOT
SCALE FROM
THIS PRINT
-GP: GUIDE POST
-014, -028, -042
(USE QTE-20-01-D-EMX-XX-GP
**-056, **-070
(SEE FIG 2, SHEET 2)
(PER ROW)
* = SEE NOTE 11
**SEE NOTES 12 & 14
EDGE MOUNT THICKNESS
LEAD STYLE
-01: .1680 [4.267]
-EM2: .064[1.63] +/-.004 PCB
(USE QTE-20-01-D-EM2-XX & T-1S42-01-XXX)
*-EM3:(USE QTE-20-01-D-EM3-XX &
T-1S42-02-XXX)
C
({No OF POS / 14} x .7875 [20.003]) + .3900 [9.906] REF
(SEE NOTE 11)
(No OF POS / 14) x .7875 [20.003] REF
.7875 20.003 REF
DIFFERENTIAL PAIR
* = NOT ENGINEERING
01
02
ROW SPECIFICATION
-D: DOUBLE (USE QTE-20-XX-D-EMX-XX)
APPROVED
.2350 5.969
REF
.1550 3.937 REF
.0400 1.016
No OF BANKS
PLATING SPECIFICATION
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN
ON TAIL (T-1S42-XX-F & T-1G1-01-F SEE NOTE 6)
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN
ON TAILS (USE T-1S42-XX-L & T-1G1-01-L)
-H: 30µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-H & T-1G1-01-G)
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD
(90%/10 +/-5%) TAIL (USE T-1S42-XX-STL & T-1G1-01-STL)
-FTL: 3µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD
(90%/10 +/-5%) TAIL (USE T-1S42-XX-FTL & T-1G1-01-FTL)
.6440 16.358
QTE-20-01-D-EMX-XX
.0333 0.845 REF
6 EQ SPACES
@ .0945[2.400]
FIG 1
C
.160 4.06 REF
T-1G1-01-XXX
.155±.003 3.94±0.08
"A"
C
.1680 4.267
(SEE NOTE 7)
.2782 7.067
REF
C
.1750 4.445
REF
.118 3.00
T-1S42-XX-XXX
SEE TABLE 2
C
"A"
.7450 18.923 REF
C
.0400 1.016
REF
"A" REF
.0080 0.203
REF
"B" .0030
(INSIDE TO INSIDE OF PIN)
2 MAX SWAY
(EITHER DIRECTION)
"C" REF
.0150 0.381 REF
.0945 2.400 REF
.1420 3.607 REF
C
.0315 0.800 REF
.1275 3.239 REF
SECTION "A"-"A"
.1000 2.540 REF
.0300 0.762 REF
NOTES:
1. REPRESENTS A CRITICAL DIMENSION.
.1200 3.048 REF
C
2. MAXIMUM BURR ALLOWANCE: .0015 [0.038]
3. MINIMUM TERMINAL RETENTION: 6 OZ.
4. MINIMUM GROUND PLANE RETENTION: 1 LB.
5. PARTS TO BE MOLD-TO-POSITION.
** = SEE NOTES 12 & 14
UNLESS OTHERWISE SPECIFIED,
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. MAXIMUM VARIANCE OF .002 [0.05]
8. NOTE DELETED.
9. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
10. Http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EM PARTS.
11. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
12. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT
SAMTEC INTERCONNECT PROCESSING GROUP.
13. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
14. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01 [.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail info@SAMTEC.com code 55322
DESCRIPTION:
.XXX: .005 [.13]
.XXXX: .0020 [.051]
SHEET SCALE: 1.5:1
MATERIAL:
DO NOT SCALE DRAWING
.8mm HS EDGEMOUNT TERMINAL ASSEMBLY
INSULATOR: LCP, COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
NO.
DWG. QTE-XXX-01-XXX-D-DP-EMX-XX
KEVIN B
12/12/00
SHEET 1 OF 2
C:\EnterpriseVault\DWG\MISC\MKTG\QTE-XXX-01-XXX-D-DP-EMX-XX-MKT.SLDDRW
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