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QTE-020-04-L-D-A-L PDF预览

QTE-020-04-L-D-A-L

更新时间: 2024-11-12 06:03:59
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申泰 - SAMTEC /
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描述
Board Stacking Connector

QTE-020-04-L-D-A-L 数据手册

  
F-217  
QTE–014–01–F–D–DP–A  
®
QTE–040–01–L–D–A  
QTE–060–01–L–D–A  
(0.80 mm) .0315"  
QTE SERIES  
HIGH-SPEED GROUND PLANE HEADER  
Integral metal plane  
for power or ground  
Board Mates:  
QSE  
SPECIFICATIONS  
Standard stack heights  
from 5 mm to 25 mm  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?QTE  
Cable Mates:  
EQCD, EQDP  
(See Also Available Note)  
Insulator Material:  
Liquid Crystal Polymer  
Terminal Material:  
Phosphor Bronze  
Standoffs:  
SO  
Plating: Au or Sn over  
50 µ" (1.27 µm) Ni  
Current Rating:  
Contact:  
2 A per pin  
(1 pin powered per row)  
Ground Plane:  
23 A per ground plane  
(1 ground plane powered)  
Operating Temp Range:  
-55 °C to +125 °C  
Voltage Rating:  
HIGH-SPEED CHANNEL PERFORMANCE  
10 YEAR MFG  
WITH 50 µ" GOLD  
QTE-DP/QSE-DP @ 5 mm Mated Stack Height  
EXTENDED LIFE  
Rating based on Samtec reference channel.  
For full SI performance data visit Samtec.com  
PRODUCT  
225 VAC mated with QSE  
& 5 mm Stack Height  
Max Cycles: 100  
28  
HIGH MATING  
CYCLES  
or contact SIG@samtec.com  
G
b
p
s
RoHS Compliant: Yes  
PROCESSING  
Lead–Free Solderable: Yes  
SMT Lead Coplanarity:  
(0.10 mm) .004" max (020-060)  
Board Stacking:  
For applications requiring  
more than two connectors per  
board contact ipg@samtec.com  
LEAD  
STYLE  
PINS PER ROW  
NO. OF PAIRS  
PLATING  
OPTION  
OTHER  
OPTION  
TYPE  
QTE  
A
Specify  
LEAD  
STYLE  
from  
–K  
RECOGNITIONS  
= (7.00 mm)  
.275" DIA  
Polyimide  
Film Pick &  
Place Pad  
–020, –040, –060  
–F  
–D  
(40 total pins per bank = –D)  
For complete scope of  
recognitions see  
www.samtec.com/quality  
= Gold Flash  
= Single-Ended  
on Signal Pins and  
Ground Plane,  
Matte Tin on tails  
chart  
–014, –028, –042  
–D–DP  
= Differential Pair  
(–01 only)  
(14 pairs per bank = –D–DP)  
–TR  
= Tape & Reel  
Packaging  
(N/A –05 & –07  
lead style)  
FILE NO. E111594  
FILE NO: 090871_0_000  
–L  
= 10 µ" (0.25 µm)  
Gold on Signal Pins  
and Ground Plane,  
Matte Tin on tails  
–D–DP = (No. of Positions per Row/14)  
x (20.00) .7875  
PROTOCOLS  
• 100 GbE  
–D = (No. of Positions per Row/20)  
x (20.00) .7875  
• XAUI  
• PCI Express®  
–L  
(20.00) .7875  
–C*  
01  
= Latching  
Option  
= Electro-Polished  
Selective  
• SATA  
(5.97)  
.235  
(7.11)  
.280  
• MGT (Rocket I/O)  
• InfiniBand™  
(N/A on –042 &  
–060 positions)  
50 µ" (1.27 µm) min  
Au over 150µ"  
02  
(3.81 µm) Ni on Signal  
Pins in contact area,  
10 µ" (0.25 µm) min  
Au over 50 µ" (1.27 µm)  
Ni on Ground Plane  
in contact area,  
MatteTin over 50µ"  
(1.27 µm) min Ni on  
all solder tails  
(0.80)  
.0315  
(0.20)  
.008  
ALSO AVAILABLE  
(MOQ Required)  
QTE  
LEAD  
STYLE  
HEIGHT  
WITH QSE*  
A
• 15 mm, 22 mm and  
30 mm stack height  
A
(4.27) .168 (5.00) .197  
(7.26) .286 (8.00) .315  
(10.27) .404 (11.00) .433  
(15.25) .600 (16.00) .630  
(18.26) .718 (19.00) .748  
(24.24) .954 (25.00) .984  
(13.26) .522 (14.00) .551  
–01  
–02  
–03  
–04  
–05  
–07  
–09  
• 30 µ" (0.76 µm) Gold  
(Specify -H plating for  
Data Rate cable mating  
applications.)  
(0.76)  
.030  
• Edge Mount, Guide Posts,  
Screw Down & Friction Lock  
*Note: –C Plating passes  
10 year MFG testing  
• 56 (-DP), 80, 100  
positions per row  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
(0.64)  
.025  
(0.89)  
.035 DIA  
*Processing conditions will affect  
mated height. See SO Series for  
board space tolerances  
• Retention Option  
Contact Samtec.  
–L  
WWW.SAMTEC.COM  
Due to technical progress, all designs, specifications and components are subject to change without notice.  

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