REVISION AG
QTE-XXX-01-XXX-D-EMX-XX
OPTION
-GP: GUIDE POST
No OF POSITIONS
(USE QTE-20-01-D-EMX-XX-GP,
-020, -040, -060,
**-080, **-100
(PER ROW)
SEE FIG 2, SHEET 2)
-TY: TRAY PACKAGING
* = SEE NOTE 13
EDGE MOUNT THICKNESS
**SEE NOTE 16
-EM2: .064[1.63] +/-.004 PCB
(USE QTE-20-01-D-EM2-XX & T-1S42-01-X)
-EM3:
(No OF POSITIONS/20 x .7875 [20.003]) + .3900 [9.906] REF
LEAD STYLE
-01: .1680[4.267]
C
(USE QTE-20-01-D-EM3-XX & T-1S42-02-X)
(SEE NOTE 13)
No OF POSITIONS/20 x .7875 [20.003] REF
DO NOT
SCALE FROM
THIS PRINT
.7875 20.003 REF
ROW SPECIFICATION
-D: DOUBLE (USE QTE-20-XX-D-EMX-XX)
01
PLATING SPECIFICATION
No OF BANKS
.2350 5.97
.1550 3.937 REF
REF
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
(USE T-1S42-XX-F & T-1G1-01-F) (SEE NOTE 11)
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
02
.645 16.38
REF
-H: 30µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-H & T-1G1-01-G)
.0333 0.84 REF
QTE-20-01-D-EMX-XX
-C: 50µ" GOLD IN CONTACT AREA, 3µ" GOLD ON TAIL
(USE T-1S42-XX-C & T-1G1-01-L)
19 EQ SPACES
@ .0315 [.800]
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-STL & T-1G1-01-STL)
-FTL: 3µ" SELECTIVE GOLD IN CONTACT AREA, TIN/LEAD (90%/10 +/-5%) TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
C
T-1G1-01-XXX
.1600 4.064 REF
.155±.003 3.94±0.08
"A"
"A"
C
C
.118 3.00
.168 4.27 (SEE NOTE 10)
.2782 7.067
REF
T-1S42-XX-X
.1750 4.45 REF
"C" REF
SEE TABLE 1
.7450 18.92
REF
C
C
.0080 0.203 REF
"A" REF
"B"±.0030 "B"±0.08
(INSIDE TO
INSIDE OF PIN)
.1275 3.24 REF
.0400 1.016 REF
2 MAX SWAY
(EITHER DIRECTION)
.0150 0.381 REF
C
.1420 3.607 REF
FIG 1
SECTION "A"-"A"
QTE-060-01-XXX-D-EM2 SHOWN
.0300 0.762 REF
.1200 3.048 REF
NOTES:
C
1.
REPRESENTS A CRITICAL DIMENSION.
2. NOTE DELETED.
3. MAXIMUM BURR ALLOWANCE: .0015 [0.03]
4. MINIMUM TERMINAL RETENTION: 6 OZ.
5. MINIMUM GROUND PLANE RETENTION: 1 LB.
6. PARTS TO BE MOLD-TO-POSITION.
7. NOTE DELETED.
** = SEE NOTE 16
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
8. NOTE DELETED.
9. NOTE DELETED.
10. MAXIMUM VARIANCE: .002 [0.05].
11. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
TOLERANCES ARE:
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
.XX: .01 [.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005 [.13]
PHONE: 812-944-6733
FAX: 812-948-5047
code 55322
.XXXX: .0020 [.051]
12. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm FOR INFORMATION ON
PROCESSING EDGE MOUNT PARTS TO BOARDS.
e-Mail info@SAMTEC.com
DESCRIPTION:
SHEET SCALE: 1:0.8
MATERIAL:
DO NOT SCALE DRAWING
13. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
14. NOTE DELETED.
.8mm EDGEMOUNT HS TERMINAL ASSEMBLY
INSULATOR: LCP COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
DWG. NO.
15. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
16. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
QTE-XXX-01-XXX-D-EMX-XX
DEAN P
9/2/1999
SHEET 1 OF 2
BY:
F:\DWG\MISC\MKTG\QTE-XXX-01-XXX-D-EMX-XX-MKT.SLDDRW
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