F-210
QSH–060–01–L–D–DP–A
®
QSH–060–01–L–D–A
(0,50mm) .0197"
QSH SERIES
QSH–030–01–F–D–A–RT1
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
for power or ground
Board Mates:
QTH
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Cable Mates:
HQCD, HQDP,
HFHM2
(See Application
Specific note)
®
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Alignment
Pin
TM
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
EXTENDED LIFE PRODUCT
10 Year Mixed Flowing Gas (MFG)
Call Samtec for maximum cycles mated with QSH
Blade &
Beam Design
5mm Stack Height
Type Rated @ -3dB Insertion Loss
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Single-Ended Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
9.5 GHz / 19 Gbps
ALSO AVAILABLE
Differential Pair Signaling –DP
Performance data for other stack heights and complete
test data available at www.samtec.com?QSH or contact
sig@samtec.com
Board Spacing Standoffs.
See SO Series.
Processing:
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
TYPE
QSH
01
A
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
–K
= (8,25mm)
.325" DIA
Polyimide Film
Pick &
–F
–D
–030, –060, –090, –120
= Gold Flash on Signal Pins
and Ground Plane,
MatteTin on tails
= Single-Ended
(60 total pins per bank = –D)
–D–DP
= Differential Pair
(–01 only)
–020, –040, –060, –080
Place Pad
(20 pairs per bank = –D–DP)
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
–L
–TR
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
MatteTin on tails
= Tape & Reel
(–090 positions
maximum)
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
–RT1
= Retention
Option
(–090 positions
maximum)
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over
150µ" (3,81µm) Ni on Signal
Pins in contact area,
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground
Plane in contact area,
MatteTin over 50µ" (1,27µm)
min Ni on all solder tails
02
STACK HEIGHTS
(7,49)
.295
QTH
MATED HEIGHT
LEAD
WITH QSH
(5,00) .197
(8,00) .315
(11,00) .433
(16,00) .630
(19,00) .748
(25,00) .984
STYLE
–01
–02
–03
–04
–05
–07
01
(0,50)
.0197
(0,15)
.006
(7,24)
.285
(0,76)
.030
(3,81)
.150
(0,89)
.035
DIA
*Note: –C Plating passes
10 year MFG testing
(3,76)
.148
DIA
(3,25)
.128
(3,05)
.120
Processing conditions will
affect mated height.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–RT1
WWW.SAMTEC.COM
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