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QSH-090-03-F-D-A PDF预览

QSH-090-03-F-D-A

更新时间: 2024-11-11 08:21:55
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申泰 - SAMTEC /
页数 文件大小 规格书
1页 774K
描述
Board Stacking Connector, 180 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

QSH-090-03-F-D-A 数据手册

  
F-210  
QSH–060–01–L–D–DP–A  
®
QSH–060–01–L–D–A  
(0,50mm) .0197"  
QSH SERIES  
QSH–030–01–F–D–A–RT1  
HIGH SPEED GROUND PLANE SOCKET  
Integral metal plane  
for power or ground  
Board Mates:  
QTH  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?QSH  
Cable Mates:  
HQCD, HQDP,  
HFHM2  
(See Application  
Specific note)  
®
Insulator Material:  
Liquid Crystal  
Polymer  
Contact Material:  
Phosphor Bronze  
Plating:  
Au or Sn over 50µ" (1,27µm) Ni  
Current Rating:  
TM  
Contact: 1.0A @ 30°C  
Temperature Rise  
Ground Plane: 7.8A @ 30°C  
Temperature Rise  
Operating Temp Range:  
-55°C to +125°C  
EXTENDED LIFE PRODUCT  
10 Year Mixed Flowing Gas (MFG)  
Call Samtec for maximum cycles mated with QSH  
Blade &  
Beam Design  
5mm Stack Height  
Type Rated @ -3dB Insertion Loss  
Voltage Rating:  
125 VAC (5mm Stack Height)  
Max Cycles:  
100  
Unmating Force (-RT1 option):  
-RT1 option increases  
unmating force up to 50%  
RoHS Compliant:  
Yes  
Single-Ended Signaling  
Differential Pair Signaling  
–D  
–D  
9 GHz / 18 Gbps  
8 GHz / 16 Gbps  
9.5 GHz / 19 Gbps  
ALSO AVAILABLE  
Differential Pair Signaling –DP  
Performance data for other stack heights and complete  
test data available at www.samtec.com?QSH or contact  
sig@samtec.com  
Board Spacing Standoffs.  
See SO Series.  
Processing:  
PINS PER ROW  
NO. OF PAIRS  
PLATING  
OPTION  
OTHER  
OPTION  
Max Processing Temp:  
230°C for 60 seconds, or  
260°C for 20 seconds 3x  
Lead–Free Solderable:  
Yes  
TYPE  
QSH  
01  
A
SMT Lead Coplanarity:  
(0,10mm) .004" max (030-060)  
(0,15mm) .006" max (090-120)  
Board Stacking:  
For applications requiring  
more than two connectors  
per board or 4 banks or more,  
contact ipg@samtec.com  
–K  
= (8,25mm)  
.325" DIA  
Polyimide Film  
Pick &  
–F  
–D  
–030, –060, –090, –120  
= Gold Flash on Signal Pins  
and Ground Plane,  
MatteTin on tails  
= Single-Ended  
(60 total pins per bank = –D)  
–D–DP  
= Differential Pair  
(–01 only)  
–020, –040, –060, –080  
Place Pad  
(20 pairs per bank = –D–DP)  
APPLICATION  
SPECIFIC OPTION  
• 14mm, 15mm, 22mm and  
30mm stack height  
–L  
–TR  
= 10µ" (0,25µm)  
Gold on Signal Pins  
and Ground Plane,  
MatteTin on tails  
= Tape & Reel  
(–090 positions  
maximum)  
(Caution: Some automatic  
placement/inspection  
machines may have  
component height  
restrictions. Please consult  
machinery specifications.)  
• 30µ" (0,76µm) Gold  
(Specify -H plating for Data  
Rate cable mating  
applications.)  
• Edge Mount & Guide Posts  
• 150 positions per row  
Call Samtec.  
RT1  
= Retention  
Option  
(–090 positions  
maximum)  
–C*  
= Electro-Polished Selective  
50µ" (1,27µm) min Au over  
150µ" (3,81µm) Ni on Signal  
Pins in contact area,  
–D = (No. of Pins per Row/30) x  
(20,00) .7875 + (1,27) .050  
–DP = (No. of Pairs per Row/20) x  
(20,00) .7875 + (1,27) .050  
(20,00) .7875  
10µ" (0,25µm) min Au over  
50µ" (1,27µm) Ni on Ground  
Plane in contact area,  
MatteTin over 50µ" (1,27µm)  
min Ni on all solder tails  
02  
STACK HEIGHTS  
(7,49)  
.295  
QTH  
MATED HEIGHT  
LEAD  
WITH QSH  
(5,00) .197  
(8,00) .315  
(11,00) .433  
(16,00) .630  
(19,00) .748  
(25,00) .984  
STYLE  
–01  
–02  
–03  
–04  
–05  
–07  
01  
(0,50)  
.0197  
(0,15)  
.006  
(7,24)  
.285  
(0,76)  
.030  
(3,81)  
.150  
(0,89)  
.035  
DIA  
*Note: –C Plating passes  
10 year MFG testing  
(3,76)  
.148  
DIA  
(3,25)  
.128  
(3,05)  
.120  
Processing conditions will  
affect mated height.  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
–RT1  
WWW.SAMTEC.COM  

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