ASO ONLY (APPLICATION SPECIFIC ORDER)
REVISION K
QSH-XXX-01-X-D-EMX
No OF POSITIONS
((No OF POS / 30) x .7875[20.003] + .440[11.18] REF
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QSH-30-01-D-EM2-XX & C-162-01-X)
-030, -060, -090,
C1
*-120, *-150
(No OF POS / 30 x .7875[20.003]) + .0100[.254] REF
(PER ROW)
-EM3: (U&SCE-Q16SH2--0320--X01)-SD-EEEM3N-XOX TE 10
29 EQ SPACES @ .0197[.500]
LEAD STYLE
-01: .1380[3.505]
ROW SPECIFICATION
.0420 1.067
REF
DO NOT
SCALE FROM
THIS PRINT
-D: DOUBLE (USE QSH-30-01-D-EMX-XX)
.7875 20.003
(TYP)
PLATING SPECIFICATION
02
No OF BANKS
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS
(USE C-162-XX-F & T-1G13-01-F)
(SEE NOTE 6)
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS
(USE C-162-XX-L & T-1G13-01-L)
-H: HEAVY GOLD
.285 7.239
REF
(USE C-162-XX-H & T-1G13-01-G)
01
'B'
.625 15.88
REF
* -120, -150 DO NOT DESIGN IN. SAMTEC
WILL ONLY SUPPORT EXISTING BUSINESS 12/07/07.
(SEE NOTE 11)
.175 4.45
REF
QSH-30-01-D-EMX-XX
C4
C2
QSH-30-01-D-EM2-XX
QSH-30-01-D-EM3-XX
C-162-02-X
T-1G13-01-X
.1370±.0030 3.480±0.076
(SEE NOTE 5)
.1180 2.997
C-162-01-X
"A"
.238 6.05
REF
SEE TABLE 1
'A'
.120 3.05 REF
"A"
K
C5
.006 0.15 REF
K
C6
.0660±.0030 1.68±0.08
.120 3.05
REF
.7250 18.415 REF
.0920±.0030 2.34±0.08
SECTION "A-A"
EDGE MOUNT THICKNESS
-EM2: .064 [1.63] +/-.004 PCB
SECTION "A-A"
.1682 4.273
REF
EDGE MOUNT THICKNESS
-EM3:
NOTES:
C3
SEE NOTE 10
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
2
MAX SWAY
(TYP)
1. C REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE "MOLD TO POSITION".
5. MAX VARIANCE OF .002[.05].
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATED SIGNAL PIN.
7. NOTE DELETED.
8. NOTE DELETED.
9. SEE www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS TO
BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE
CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT
SAMTEC INTERCONNECT PROCESSING GROUP.
.1000 2.540 REF
.0400 1.016 REF
.1400 3.556 REF
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
ANGLES
2
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
.XXX: .005[.13]
.XXXX: .0020[.051]
C8
SHEET SCALE: 1.375:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
.5mm EDGE MOUNT HIGH SPEED SOCKET ASSEMBLY
DWG.
INSULATOR: LCP, COLOR: BLACK
CONTACT & GROUND PLANE: PHOS BRONZE
NO. QSH-XXX-01-X-D-EMX
BY:
DEAN P
5/31/2000
SHEET 1 OF 2
F:\DWG\MISC\MKTG\QSH-XXX-01-X-D-EMX-MKT.SLDDRW