REVISION AD
QSE-XXX-01-X-D-EMX-XX
No OF POSITIONS
((No OF POSITIONS / 20) x .7875[20.003]) + .440[11.18] REF
C
OPTION
-020, -040, -060
**-080, **-100
(PER ROW)
-GP: GUIDE POST (60 POS MAX)
*
((No OF POSITIONS / 20) x .7875[20.003]) + .0100[.254] REF
(SEE FIG 2, SEE SHEET 2)
-TY: TRAY PACKAGING
* EM3-GP = NOT TOOLED
EDGE MOUNT THICKNESS
LEAD STYLE
-01: .1380 [3.505]
19 EQ SPACES
@ .0315[.800]
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-EM3:
02
01
DO NOT
SCALE FROM
THIS PRINT
PLATING SPECIFICATION
PLATING THICKNESSES ARE FOR
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
.2850 7.239
REF
(USE QSE-20-01-D-EM3-XX & C-162-02-X)
(SEE NOTE 10)
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
'A'
.625 15.88
REF
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
.022 0.57
REF
(USE C-162-XX-L & T-1G13-01-L)
No OF BANKS
* = SEE NOTE 10
-H: 30µ" HEAVY GOLD IN CONTACT AREA
3µ" FLASH GOLD ON TAILS
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
** = SEE NOTE 13
C
.118 3.00
QSE-20-01-D-EM2-XX
C
SEE NOTE 12
QSE-20-01-D-EM3-XX
(USE C-162-XX-S & T-1G13-01-L)
C-162-01-X
.1750 4.445
REF
.1380±.0030 3.505±0.08
(SEE NOTE 5)
C-162-02-X
"A"
"A"
.165±.003 4.19±0.076
C
C
.238 6.05
REF
SEE TABLE 1
.120 3.05 REF
C
.0920±.0030 2.338±0.08
.155 3.92
REF
.0660±.0030 1.676±0.08
T-1G13-01-X
.006 0.15
REF
C
SECTION "A"-"A"
SECTION "A"-"A"
-EM2: .064[1.63] +/-.004 PCB
.7250 18.415
REF
C
2
MAX SWAY
-EM3:
SEE NOTE 10
(EITHER DIRECTION)
.1200 3.048
REF
[DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS]
.0315 0.800
REF
FIG 1
.0400 1.016 REF
.100 2.54 REF
.1400 3.556 REF
NOTES:
C
1.
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM CONTACT RETENTION: 6 OZ
3. MINIMUM GROUND PLANE RETENTION: 8 OZ
4. PARTS ARE MOLD TO POSITION.
** = SEE NOTE 13
5. MAXIMUM VARIANCE OF .002[0.05]
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
2
9. SEE WWW.SAMTEC. COM/PROCESSING/
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
EDGEMOUNT_TECTALK/INDEX.HTM FOR INFORMATION ON
PROCESSING EDGEMOUNT PARTS TO BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH
ORDER INQUIRIES
.XXX: .005[.13]
PHONE: 812-944-6733
FAX: 812-948-5047
code 55322
.XXXX: .0020[.051]
e-Mail info@SAMTEC.com
SHEET SCALE: 1.375:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
.8mm EDGE MOUNT HS SOCKET ASSEMBLY
INSULATOR: LCP, UL 94VO
-EM2 COLOR: BLACK
-EM3 COLOR: NATURAL
CONTACT & GROUND PLANE: PHOS BRONZE
11. NOTE DELETED.
NO.
DWGQ. SE-XXX-01-X-D-EMX-XX
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
13. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
SHEET 1 OF 2
BY:
DEAN P
5/24/2000
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
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