Datasheet > QSE-060-01-C-D-DP-A-RT1

QSE-060-01-C-D-DP-A-RT1

更新时间： 2024-11-26 04:25:31

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
1页	1050K
描述
Board Stacking Connector

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中文翻译

获取价格

数据手册

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QSE-060-01-C-D-DP-A-RT1 数据手册

QSE–028–01–F–D–DP–A–RT1

F-212

QSE–060–01–F–D–A

(0,80mm) .0315"

QSE SERIES

QSE–020–01–L–D–A–RT1

HIGH SPEED GROUND PLANE SOCKET

Integral metal plane

for power or ground

Board Mates:

QTE

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?QSE

Cable Mates:

EQCD, EQSD, EQDP, EQRF

(See Application Speciﬁc note)

Insulator Material:

Liquid Crystal

Polymer

Terminal Material:

Phosphor Bronze

Plating:

EXTENDED LIFE PRODUCT

Au or Sn over 50µ" (1,27µm) Ni

Current Rating:

10 year Mixed Flowing Gas with 50µ" Gold

Call Samtec for maximum cycles mated with QTE

Contacts: 1.3A @ 95°C

Ground Plane: 10.1A @ 95°C

Operating Temp Range:

-55°C to +125°C

Rated @ 3dB Insertion Loss

with PCB effects* w/o PCB effects**

QTE/QSE

Type

Voltage Rating:

5mm Stack Height

225 VAC (5mm Stack Height)

Max Cycles:

Single-Ended Signaling

Differential Pair Signaling

–D

9 GHz / 18 Gbps

8 GHz / 16 Gbps

7.5 GHz / 15 Gbps

8.5 GHz / 17 Gbps

––––

Blade & Beam Design

100

Unmating Force (-RT1 option):

-RT1 option increases

unmating force up to 50%

RoHS Compliant:

Yes

–DP 8.5 GHz / 17 Gbps

ALSO

*Performance data includes effects of a non-optimized PCB.

**Test board losses de-embedded from performance data.

AVAILABLE

Board Spacing Standoffs.

See SO Series.

Performance data for other stack heights and complete test data

available at www.samtec.com?QSE or contact sig@samtec.com

Processing:

Lead–Free Solderable:

Yes

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

OTHER

OPTION

SMT Lead Coplanarity:

(0,10mm) .004" max (020-060)

(0,15mm) .006" max (080)

Board Stacking:

TYPE

QSE

For applications requiring

more than two connectors

per board or 4 banks or more,

contact ipg@samtec.com

–F

= Gold Flash on

Signal Pins and

Ground Plane, Matte

Tin on tails

–D

= Single-

Ended

–K

–020, –040, –060, –080

= (8,25mm) .325"

DIA Polyimide

Film Pick &

(40 total pins per bank = –D)

APPLICATION

SPECIFIC OPTION

–014, –028, –042, –056

Place Pad

–D–DP

= Differential

Pair

(14 pairs per bank = –D–DP)

• 14mm, 15mm, 22mm

and 30mm stack height

(Caution: Some automatic

placement/inspection

machines may have

component height

restrictions. Please

consult machinery

speciﬁcations.)

• 30µ" (0,76µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

–L

= 10µ" (0,25µm) Gold

on Signal Pins

–TR

–D–DP = (No. of Positions per Row/14) x

(20,00) .7875 + (1,27) .050

(–01 only)

= Tape & Reel

Packaging

and Ground Plane,

Matte Tin on tails

(N/A on 56 &

80 positions)

–D = (No. of Positions per Row/20) x

(20,00) .7875 + (1,27) .050

–C*

(20,00) .7875

= Electro-Polished

Selective

–RT1

= Retention

Option

(N/A on 56 &

80 positions

or –L (latch)

option)

(7,49)

.295

50µ" (1,27µm) min

Au over 150µ"

(7,24)

.285

(3,81µm) Ni on Signal

Pins in contact area,

10µ" (0,25µm) min

Au over 50µ" (1,27µm)

Ni on Ground Plane

in contact area,

MatteTin over 50µ"

(1,27µm) min Ni on

all solder tails

(0,80)

.0315

(0,15)

.006

• Edge Mount

QTE

LEAD

MATED

HEIGHT

(3,25)

.128

• 100 positions per row

• Guide Posts and Friction

–L

STYLE WITH QSE*

= Latching

Option

(5,00) .197

–01

–02

–03

–04

Lock options

(8,00) .315

(N/A on 42,

56, 60 & 80

positions or

–RT1 option)

Call Samtec.

(3,05)

.120

(11,00) .433

(0,76)

.030

(16,00) .630

(19,00) .748

–05

(25,00) .984

–07

(3,81)

.150

(0,89)

.035

DIA

*Note: –C Plating passes

(0,64)

.025

10 year MFG testing

(3,76)

.148

DIA

*Processing

conditions will

affect mated height.

Note: Some lengths, styles

and options are non-standard,

non-returnable.

–L

–01

–RT1

WWW.SAMTEC.COM

中文翻译

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