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QSE-040-02-C-D-A PDF预览

QSE-040-02-C-D-A

更新时间: 2024-11-22 07:38:59
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申泰 - SAMTEC /
页数 文件大小 规格书
1页 751K
描述
Board Stacking Connector, 80 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

QSE-040-02-C-D-A 数据手册

  
QSE–028–01–F–D–DP–A–RT1  
F-211  
®
(0,80mm) .0315"  
QSE SERIES  
QSE–020–01–L–D–A–RT1  
QSE–060–01–F–D–A  
HIGH SPEED GROUND PLANE SOCKET  
Integral metal plane  
for power or ground  
Board Mates:  
QTE  
SPECIFICATIONS  
For complete specifications and  
• E.L.P.TM plating  
option (–C)  
Cable Mates:  
EQCD, EQSD,  
EQDP, EQRF  
(See Application  
Specific note)  
recommended PCB layouts see  
www.samtec.com?QSE  
®
• Retention pin option  
Insulator Material:  
Liquid Crystal  
Polymer  
Terminal Material:  
Phosphor Bronze  
Plating:  
Au or Sn over 50µ" (1,27µm) Ni  
Current Rating:  
TM  
Contacts: 1.3A @ 95°C  
Ground Plane: 10.1A @ 95°C  
Operating Temp Range:  
-55°C to +125°C  
EXTENDED LIFE PRODUCT  
10 year Mixed Flowing Gas with 50µ" Gold  
Call Samtec for maximum cycles mated with QTE  
Blade & Beam  
Design  
Voltage Rating:  
225 VAC (5mm Stack Height)  
Max Cycles:  
100  
Unmating Force (-RT1 option):  
-RT1 option increases  
unmating force up to 50%  
RoHS Compliant:  
Yes  
5mm Stack Height  
Type  
–D  
Rated @ 3dB Insertion Loss  
9 GHz / 18 Gbps  
Single-Ended Signaling  
Differential Pair Signaling  
Differential Pair Signaling  
ALSO  
AVAILABLE  
–D  
–DP  
8 GHz / 16 Gbps  
8.5 GHz / 17 Gbps  
Board Spacing Standoffs.  
Performance data for other stack heights and complete test data  
available at www.samtec.com?QSE or contact sig@samtec.com  
See SO Series.  
Processing:  
Lead–Free Solderable:  
Yes  
PINS PER ROW  
NO. OF PAIRS  
PLATING  
OPTION  
OTHER  
OPTION  
SMT Lead Coplanarity:  
(0,10mm) .004" max (020-060)  
(0,15mm) .006" max (080)  
Board Stacking:  
TYPE  
QSE  
A
01  
For applications requiring  
more than two connectors  
per board or 4 banks or more,  
contact ipg@samtec.com  
–F  
= Gold Flash on  
Signal Pins and  
Ground Plane, Matte  
Tin on tails  
–D  
= Single-  
Ended  
–K  
–020, –040, –060, –080  
= (8,25mm) .325"  
DIA Polyimide  
Film Pick &  
(40 total pins per bank = –D)  
APPLICATION  
SPECIFIC OPTION  
–014, –028, –042, –056  
Place Pad  
–D–DP  
= Differential  
Pair  
(14 pairs per bank = –D–DP)  
• 14mm, 15mm, 22mm  
and 30mm stack height  
(Caution: Some automatic  
placement/inspection  
machines may have  
component height  
restrictions. Please  
consult machinery  
specifications.)  
• 30µ" (0,76µm) Gold  
(Specify -H plating for  
Data Rate cable mating  
applications.)  
–L  
= 10µ" (0,25µm) Gold  
on Signal Pins  
–TR  
–D–DP = (No. of Positions per Row/14) x  
(20,00) .7875 + (1,27) .050  
(–01 only)  
= Tape & Reel  
Packaging  
and Ground Plane,  
Matte Tin on tails  
(N/A on 56 &  
80 positions)  
–D = (No. of Positions per Row/20) x  
(20,00) .7875 + (1,27) .050  
–C*  
(20,00) .7875  
= Electro-Polished  
Selective  
02  
RT1  
= Retention  
Option  
(N/A on 56 &  
80 positions  
or –L (latch)  
option)  
(7,49)  
.295  
50µ" (1,27µm) min  
Au over 150µ"  
(3,81µm) Ni on Signal  
Pins in contact area,  
10µ" (0,25µm) min  
Au over 50µ" (1,27µm)  
Ni on Ground Plane  
in contact area,  
MatteTin over 50µ"  
(1,27µm) min Ni on  
all solder tails  
(7,24)  
.285  
01  
(0,80)  
.0315  
(0,15)  
.006  
• Edge Mount  
QTE  
LEAD  
MATED  
HEIGHT  
(3,25)  
.128  
• 100 positions per row  
• Guide Posts and Friction  
–L  
STYLE WITH QSE*  
= Latching  
Option  
(5,00) .197  
–01  
–02  
–03  
–04  
Lock options  
.
(8,00) .315  
(N/A on 42,  
56, 60 & 80  
positions or  
–RT1 option)  
Call Samtec.  
(3,05)  
.120  
(11,00) .433  
(0,76)  
.030  
(16,00) .630  
(19,00) .748  
–05  
(25,00) .984  
–07  
(3,81)  
.150  
(0,89)  
.035  
DIA  
*Note: –C Plating passes  
(0,64)  
.025  
10 year MFG testing  
(3,76)  
.148  
DIA  
*Processing  
conditions will  
affect mated height.  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
–L  
–01  
–RT1  
WWW.SAMTEC.COM  

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