FIG 1
REVISION Y
QSE-XXX-01-X-D-DP-EMX-XX
QSE-042-01-X-D-DP-EMX SHOWN
OPTION
-GP: GUIDE POST
(SEE FIG 3, SHEET 2)
No OF PAIRS
ASO ONLY (APPLICATION SPECIFIC ORDER)
*
-014, -028, -042
** -056, **-070
(PER ROW)
EM3-GP=NOT TOOLED
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF
*
** SEE NOTE 13
EDGE MOUNT THICKNESS
C
LEAD STYLE
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-01: .1380[3.505]
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF
-EM3: (USE QSE-20-01-D-EM3-XX
PLATING SPECIFICATION
PLATING THICKNESSES ARE FOR
& C-162-02-X)
(SEE NOTE 10)
02
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
DIFFERENTIAL PAIR
.2850 7.239
REF
DO NOT
SCALE FROM
THIS PRINT
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
01
(USE C-162-XX-L & T-1G13-01-L)
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
3µ" FLASH GOLD ON TAIL
.6250 15.875
'D'
.0225 0.571
REF
No OF BANKS
REF
6 EQ SPACES
@ .0945 [2.400]
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(USE C-162-XX-S & T-1G13-01-L)
C
.1180 2.997
C-162-02-X
MATTE TIN ON TAIL
QSE-20-01-D-EM2-XX
QSE-20-01-D-EMX-03
C-162-01-X
.165±.003 4.19±0.08
SEE NOTE 5
SEE TABLE 1
C
.175 4.45
QSE-20-01-D-EM3-XX
.120 3.05 REF
SEE NOTE 12
"A"
REF
.2380 6.045
REF
C
C
"A"
.0920±.0030 2.338±0.076
.1370±.0030 3.480±0.08
C
.0890 2.261 REF
C
T-1G13-01-X
.7250 18.415
REF
.0660±.0030 1.676±0.076
.0580 1.473 REF
2
MAX SWAY
(TYP)
.1545 3.924
SECTION "A-A"
C
SECTION "A"-"A"
.1200 3.048
REF
.0060 0.152
REF
EDGE MOUNT THICKNESS
-EM3:
EDGE MOUNT THICKNESS
-EM2: .064 [1.63] +/-.004 PCB
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
(SEE NOTE 10)
.0400 1.016 REF
.0070 0.178 REF
C
.1000 2.540 REF
.1600 4.064 REF
NOTES:
C
** = SEE NOTE 13
1.
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM CONTACT RETENTION: 6 OZ
3. MINIMUM GROUND PLANE RETENTION: 8 OZ
4. PARTS ARE MOLD TO POSITION.
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
5. MAXIMUM VARIANCE OF .002[0.05]
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
DECIMALS
ANGLES
2
.XX: .01[.3]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
.XXX: .005[.13]
PHONE: 812-944-6733
FAX: 812-948-5047
code 55322
.XXXX: .0020[.051]
e-Mail info@SAMTEC.com
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 1.25:1
DESCRIPTION:
INSULATOR: LCP, UL 94VO
COLOR: BLACK
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY
DWG.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. NOTE DELETED.
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
13. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
NOQ. SE-XXX-01-X-D-DP-EMX-XX
CONTACT: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
DEAN P
4/10/2001
SHEET 1 OF 2
BY:
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW