F-208-1
QTH–090–01–C–D–A
®
QTH–030–01–L–D–A–RT1
QTH–060–07–F–D–A
QTH SERIES
0,50mm HI-SPEED HEADER
Integral metal plane for
power or ground
(0,50mm)
.0197"
pitch
Mates with:
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
QSH, HFHM,
HFHM2, HQCD
(See Application
Specific note)
Retention
Option
Insulator Material:
Liquid Crystal
Polymer
®
Terminal Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Standard
Stack Heights
from 5mm to 25mm
Voltage Rating:
Polarized
125 VAC (5mm Stack Height)
Max Cycles:
100
ALSO AVAILABLE
5mm Stack Height
Rated @ -3dB Insertion Loss
Differential Pair version.
See QTH-DP Series.
Board Spacing Standoffs.
See SO Series.
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Single-Ended Signaling
Differential Pair Signaling
Performance data for other stack heights
available at www.samtec.com?QTH
9 GHz / 18 Gbps
8 GHz / 16 Gbps
Processing:
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
NO. OF POSITIONS
PER ROW
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
QTH
D
A
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 120 positions or higher,
contact ipg@samtec.com
Specify
LEAD
STYLE
from
–L
–K
–030, –060, –090, –120
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
= (7,00mm) .275"
DIA Polyimide film
Pick & Place Pad
(60 total positions per bank)
chart.
QTH
LEAD
STYLE
HEIGHT
WITH QSH
A
–TR
–F
= Tape & Reel
(–090 positions
maximum)
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and 30mm
stack height (Caution: Some automatic
placement/inspection machines may
have component height restrictions.
Please consult machinery specifications.)
• 30µ" (0,76µm) Gold (Specify -H plating
for Data Rate cable mating applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,24)
.718
(24,24)
.954
(5,00)
.198
(8,00)
.316
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–01
–02
–03
–04
–RT1
= Retention Option
(–01 Lead Style
only &
–090 positions
maximum)
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over
150µ" (3,81µm) Ni on Signal
Pins in contact area,
–05
–07
10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground
Plane in contact area,
Matte Tin over 50µ" (1,27µm)
min Ni on all solder tails
(No. of Positions per Row/30) x (20,00) .7875
(20,00) .7875
01
(7,11)
.280
(3,30)
.130
02
(0,50)
.0197
(0,20)
.008
(0,76)
.030
(1,57)
.062
A
*Note: –C Plating passes
A
(1,57)
.062
DIA
–01 & –02
(0,89)
10 year MFG testing
.035
DIA
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–RT1
–03 thru –07
–01
WWW.SAMTEC.COM