Datasheet > 射频和微波 > 射频/微波耦合器> QHD-3C-3.4G

QHD-3C-3.4G

更新时间： 2024-02-24 06:51:11

品牌	Logo	应用领域
MERRIMAC		射频和微波射频耦合器微波耦合器分离技术隔离技术
页数	文件大小	规格书
5页	244K
描述
QUADRATURE HYBRID

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技术参数
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QHD-3C-3.4G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.74	Is Samacsys：	N
其他特性：	HIGH ISOLATION	构造：	COMPONENT
最大插入损耗：	0.6 dB	最大工作频率：	5000 MHz
最小工作频率：	1750 MHz	最高工作温度：	85 °C
最低工作温度：	-55 °C	射频/微波设备类型：	90 DEGREE HYBRID COUPLER
最大电压驻波比：	1.2	Base Number Matches：	1

QHD-3C-3.4G 数据手册

QHD-3C-3.4G

QUADRATURE HYBRID

PRELIMINARY REV: 001, 06/04/03

•

1.75 - 5.0 GHz

LOWEST LOSS

HIGHEST ISOLATION

BEST PHASE/AMPLITUDE BALANCE

TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX QUAD HYBRIDS

The Multi-Mix QHD series provides a 3 dB coupler with low insertion loss, low VSWR, and high isola-

tion. Accurate phase and amplitude balance make them ideal for applications involving IQ networks,

power amplifiers, signal distribution and processing.

QHD quad hybrids are fusion bonded multilayer stripline assemblies. The fusion bonding process yields

a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance

that is superior to conventional adhesive bonding techniques.

The QHD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-

tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with

common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides

excellent EM shielding.

Additional benefits include:

AVAILABLE ON

TAPE & REEL

Available on tape and reel

Cost effective for commercial wireless applications

Industry standard size

Temperature stable from –65° to +125° C.

Can be integrated with other Multi-Mix components in a multi-function module

RELIABILITY

All QHD series components are 100% tested. The product family has passed environmental screening

per MIL-TSD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture

Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).

THE MULTI-MIX PROCESS

Multi-Mix is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-

lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded

layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-

through vias to form a SMD module that requires no additional packaging and is ready for pick and

place.

THE MULTI-MIX MICROTECHNOLOGY GROUP IS ISO-9001 REGISTERED

U.S. patent 6,099,677 and other patents pending.

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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