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Q67100-Q1838 PDF预览

Q67100-Q1838

更新时间: 2024-01-14 10:40:47
品牌 Logo 应用领域
英飞凌 - INFINEON 动态存储器
页数 文件大小 规格书
53页 410K
描述
64-MBit Synchronous DRAM

Q67100-Q1838 数据手册

 浏览型号Q67100-Q1838的Datasheet PDF文件第2页浏览型号Q67100-Q1838的Datasheet PDF文件第3页浏览型号Q67100-Q1838的Datasheet PDF文件第4页浏览型号Q67100-Q1838的Datasheet PDF文件第5页浏览型号Q67100-Q1838的Datasheet PDF文件第6页浏览型号Q67100-Q1838的Datasheet PDF文件第7页 
HYB 39S64400/800/160BT(L)  
64-MBit Synchronous DRAM  
64-MBit Synchronous DRAM  
• High Performance:  
• Multiple Burst Read with Single Write  
Operation  
• Automatic and Controlled Precharge  
Command  
-7.5 -8  
Units  
fCKMAX  
tCK3  
133 125 MHz  
• Data Mask for Read/Write Control (x4, x8)  
• Data Mask for Byte Control (x16)  
• Auto Refresh (CBR) and Self Refresh  
• Suspend Mode and Power Down Mode  
• 4096 Refresh Cycles / 64 ms  
7.5  
5.4  
10  
6
8
ns  
ns  
ns  
ns  
tAC3  
6
tCK2  
10  
6
tAC2  
• Random Column Address every CLK  
(1-N Rule)  
• Fully Synchronous to Positive Clock Edge  
• 0 to 70 °C operating temperature  
• Four Banks controlled by BA0 & BA1  
• Programmable CAS Latency: 2, 3  
• Single 3.3 V ± 0.3 V Power Supply  
• LVTTL Interface  
• Plastic Packages:  
P-TSOPII-54 400mil width (x4, x8, x16)  
• Programmable Wrap Sequence: Sequential  
or Interleave  
• -7.5 version for PC133 3-3-3 application  
-8 version for PC100 2-2-2 applications  
• Programmable Burst Length: 1, 2, 4, 8  
• Full page (optional) for sequential wrap  
around  
The HYB 39S64400/800/160BT are four bank Synchronous DRAM’s organized as  
4 banks × 4MBit ×4, 4 banks × 2 MBit ×8 and 4 banks × 1 Mbit ×16 respectively. These synchron-  
ous devices achieve high speed data transfer rates by employing a chip architecture that prefects  
multiple bits and then synchronizes the output data to a system clock. The chip is fabricated using  
the Infineon advanced 0.2 µm 64 MBit DRAM process technology.  
The device is designed to comply with all JEDEC standards set for Synchronous DRAM products,  
both electrically and mechanically. All of the control, address, data input and output circuits are  
synchronized with the positive edge of an externally supplied clock.  
Operating the four memory banks in an interleave fashion allows random access operation to occur  
at higher rates than is possible with standard DRAMs. A sequential and gapless data rate is  
possible depending on burst length, CAS latency and speed grade of the device.  
Auto Refresh (CBR) and Self Refresh operation are supported. These devices operates with a  
single 3.3 V ± 0.3 V power supply and are available in TSOPII packages.  
Data Book  
1
12.99  

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