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PZ94026-3166-01F PDF预览

PZ94026-3166-01F

更新时间: 2024-11-18 15:48:43
品牌 Logo 应用领域
富士康 - FOXCONN PC
页数 文件大小 规格书
1页 194K
描述
IC Socket, BGA940, 940 Contact(s), Surface Mount, LEAD FREE

PZ94026-3166-01F 技术参数

生命周期:Active包装说明:LEAD FREE
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8536.69.40.40风险等级:5.67
其他特性:STANDARD: 94V-0主体宽度:1.893 inch
主体深度:0.244 inch主体长度:2.014 inch
触点的结构:31X31联系完成配合:GOLD (10)
联系完成终止:GOLD (10)触点材料:CU ALLOY
触点样式:RND PIN-SKT设备插槽类型:IC SOCKET
使用的设备类型:BGA940介电耐压:650VAC V
外壳材料:THERMOPLASTIC绝缘电阻:1000000000 Ω
JESD-609代码:e4插接触点节距:0.05 inch
安装方式:STRAIGHT触点数:940
最高工作温度:110 °C最低工作温度:-55 °C
PCB接触模式:RECTANGULAR端接类型:SURFACE MOUNT
Base Number Matches:1

PZ94026-3166-01F 数据手册

  
SPECIFICATIONS  
BGA 940 AM2 T2  
BGA CPU Socket  
Mechanical  
BGA SMT Type  
Contact Rentention Force: 0.13kgf min.  
Durability: 50 Cycles min.  
1.27X1.27mm [.05X.05”] Pitch  
940 Pos.  
Solder Ball Shear Force: 750gf min.  
Unlatch Force: 240gf min.  
Electrical  
Contact Resistance : 25 mmax.  
Insulation Resistance: 1000mmin.  
Dielectric Withstanding Voltage: 650 VAC min.  
Physical  
Base: Thermoplastic, UL 94V-0 rated, Black Color  
Cover: Thermoplastic, UL 94V-0 rated, Natural Color  
Cam: Stainless Steel  
Contact: Copper Alloy  
Plating: See “ORDERING INFORMATION”  
Operating Temperature: -55to +110℃  
DRAWING  
LF  
ORDERING INFORMATION  
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.  
14  

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