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PSMN0R7-25YLD PDF预览

PSMN0R7-25YLD

更新时间: 2024-09-16 11:12:15
品牌 Logo 应用领域
安世 - NEXPERIA 开关脉冲晶体管
页数 文件大小 规格书
14页 273K
描述
N-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 TechnologyProduction

PSMN0R7-25YLD 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PSSO-G4Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.38
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):174 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:25 V最大漏极电流 (ID):300 A
最大漏源导通电阻:0.00092 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G4JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):1482 A参考标准:IEC-60134
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

PSMN0R7-25YLD 数据手册

 浏览型号PSMN0R7-25YLD的Datasheet PDF文件第2页浏览型号PSMN0R7-25YLD的Datasheet PDF文件第3页浏览型号PSMN0R7-25YLD的Datasheet PDF文件第4页浏览型号PSMN0R7-25YLD的Datasheet PDF文件第5页浏览型号PSMN0R7-25YLD的Datasheet PDF文件第6页浏览型号PSMN0R7-25YLD的Datasheet PDF文件第7页 
PSMN0R7-25YLD  
N-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in  
LFPAK56 using NextPowerS3 Technology  
25 July 2017  
Product data sheet  
1. General description  
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package.  
NextPowerS3 portfolio utilising NXP's unique "SchottkyPlus" technology delivers high efficiency,  
low spiking performance usually associated with MOSFETS with an integrated Schottky or  
Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly  
suited to high efficiency applications at high switching frequencies.  
2. Features and benefits  
100% Avalanche tested at I(AS) = 190 A  
Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching  
frequencies  
Superfast switching with soft-recovery  
Low spiking and ringing for low EMI designs  
Unique "SchottkyPlus" technology; Schottky-like performance with < 1 μA leakage at 25 °C  
Optimised for 4.5 V gate drive  
Low parasitic inductance and resistance  
High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds,  
qualified to 150 °C  
Wave solderable; exposed leads for optimal visual solder inspection  
3. Applications  
On-board DC:DC solutions for server and telecommunications  
Secondary-side synchronous rectification in telecommunication applications  
Voltage regulator modules (VRM)  
Point-of-Load (POL) modules  
Power delivery for V-core, ASIC, DDR, GPU, VGA and system components  
Brushed and brushless motor control  
Power OR-ing  
4. Quick reference data  
Table 1. Quick reference data  
Symbol  
VDS  
Parameter  
Conditions  
Min  
Typ  
Max  
25  
Unit  
V
drain-source voltage  
drain current  
25 °C ≤ Tj ≤ 150 °C  
VGS = 10 V; Tmb = 25 °C; Fig. 2  
-
-
-
-
-
-
ID  
[1]  
300  
158  
A
Ptot  
total power dissipation Tmb = 25 °C; Fig. 1  
W
Static characteristics  
RDSon drain-source on-state  
resistance  
VGS = 4.5 V; ID = 25 A; Tj = 25 °C;  
Fig. 10  
-
0.76  
0.92  
mΩ  
 
 
 
 

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