PS12 thru PS14
Surface Mount Schottky Rectifier
Reverse Voltage 20~40V Forward Current 1.0A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
• High temperature soldering guaranteed: 260℃/10 seconds
iSGA
(SOD-123HS)
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device,
power supplies and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PS12
PS13
PS14
Unit
Parameter
Symbol
20
14
20
30
21
30
1.0
40
28
40
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
V
V
V
A
VRRM
VRMS
VDC
IF(AV)
30
4
A
IFSM
I2t
A2sec
Rating for fusing(t<8.3ms)
- 55 to + 150
- 55 to + 150
Operating junction temperature range
Storage temperature range
TJ
°C
°C
TSTG
Electrical Characteristics (TA = 25 °C unless otherwise noted)
PS12
PS13
PS14
Unit
Parameter
Test Conditions Symbol
20
30
0.50
0.50
50
40
VBR
VF
Ta=25℃,IR=1mA
IF=1A,Ta=25℃
IF=1A,Ta=75℃
Ta=25℃
Minimum Breakdown voltage
Volts
Maximum instantaneous
forward voltage
uA
mA
pF
Maximum DC reverse current
at rated DC blocking voltage
IR
1
Ta=75℃
51.2
65
CJ
Typical junction capacitance
Typical thermal resistance
4.0 V, 1 MHz
1)
juntion to ambient
RθJA
RθJL
1)
2)
9
℃/W
juntion to lead
juntion to case
35
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.05-Rev.A