U0404FC30C
Only One Name Means ProTek’Tion™
UNBUMPED FLIP CHIP TVS ARRAY
DESCRIPTION
The U0404FC30C flip chip employs advanced silicon P/N juncꢀon technology for unmatched board-level transient voltage protecꢀon against Electrostaꢀc Discharge
(ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protecꢀon, this device meets the IEC 61000-4-2 and 61000-4-4 requirements.
These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protecꢀon greater than 25 kilovolts with a peak pulse power dissipaꢀon of 250 Waꢁs per line for an 8/20µs waveform. In addiꢀon, the
U0404FC30C features superior clamping performance, low leakage current characterisꢀcs and a response ꢀme of less than a nanosecond. Their low inductance virtu-
ally eliminates overshoot voltage due to package inductance.
APPLICATIONS
FEATURES
• Cellular Phones
• MCM Boards
• Wireless Communicaꢀon Circuits
• IR LEDs
• SMART & PCMCIA Cards
• Compaꢀble with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compaꢀble with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protecꢀon > 25 kilovolts
• Available in 30V
• 250 Waꢁs Peak Pulse Power per Line (tp = 8/20µs)
• Bidirecꢀonal Configuraꢀon and Monolithic Structure
• Protecꢀon for 1 - 3 Lines
• RoHS Compliant
• REACH Compliant
MECHANICAL CHARACTERISTICS
• Standard EIA Chip Size: 0404
• Approximate Weight: 0.73 milligrams
• Lead-Free Plaꢀng
• Solder Reflow Temperature:
•
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Raꢀng UL 94V-0
• 8mm Plasꢀc Tape per EIA Standard 481
PIN CONFIGURATION
www.protekdevices.com
05508.R0 8/16
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