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FIN1104 PDF预览

FIN1104

更新时间: 2024-02-05 19:03:12
品牌 Logo 应用领域
久正 - POWERTIP /
页数 文件大小 规格书
6页 361K
描述
LVDS 4 Port High Speed Repeater

FIN1104 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TSSOP
包装说明:TSSOP, TSSOP24,.25针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.6
差分输出:YES驱动器位数:4
输入特性:DIFFERENTIAL接口集成电路类型:LINE TRANSCEIVER
接口标准:EIA-644-A; TIA-644-AJESD-30 代码:R-PDSO-G24
JESD-609代码:e4长度:7.8 mm
湿度敏感等级:1功能数量:4
端子数量:24最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP24,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:1.75 ns
接收器位数:4座面最大高度:1.2 mm
子类别:Line Driver or Receivers最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED最大传输延迟:1.75 ns
宽度:4.4 mm

FIN1104 数据手册

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January 2002  
Revised January 2003  
FIN1104  
LVDS 4 Port High Speed Repeater  
General Description  
Features  
This 4 port repeater is designed for high speed intercon-  
nects utilizing Low Voltage Differential Signaling (LVDS)  
technology. The FIN1104 accepts and outputs LVDS levels  
with a typical differential output swing of 330 mV which pro-  
vides low EMI at ultra low power dissipation even at high  
frequencies. The FIN1104 provides a VBB reference for AC  
Greater than 800 Mbps data rate  
3.3V power supply operation  
3.5 ps maximum random jitter and 135 ps maximum  
deterministic jitter  
Wide rail-to-rail common mode range  
LVDS receiver inputs accept LVPECL, HSTL, and  
SSTL-2 directly  
coupling on the inputs. In addition the FIN1104 can directly  
accept LVPECL, HSTL, and SSTL-2 for translation to  
LVDS.  
Ultra low power consumption  
20 ps typical channel-to-channel skew  
Power off protection  
> 7.5 kV HBM ESD Protection  
Meets or exceeds the TIA/EIA-644-A LVDS standard  
Available in space saving 24-Lead TSSOP package  
Open circuit fail safe protection  
VBB reference output  
Ordering Code:  
Order Number Package Number  
Package Description  
FIN1104MTC  
MTC24  
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pin Descriptions  
Connection Diagram  
Pin Name  
Description  
RIN1+, RIN2+  
RIN3+, RIN4+  
,
Non-inverting LVDS Input  
RIN1, RIN2−  
RIN3, RIN4−  
,
Inverting LVDS Input  
DOUT1+, DOUT2+, Non-inverting Driver Output  
DOUT3+, DOUT4+  
DOUT1, DOUT2, Inverting Driver Output  
DOUT3, DOUT4−  
EN  
Driver Enable Pin for All Output  
EN  
Inverting Driver Enable Pin for all Outputs  
Power Supply  
VCC  
GND  
VBB  
Ground  
Reference Voltage Output  
© 2003 Fairchild Semiconductor Corporation  
DS500656  
www.fairchildsemi.com  

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