LEADFRAME
data sheet
®
PowerSOP 2&3
Features:
Exceptional performance through the innovative design of PSOPs offer:
•
•
•
Up to 50% improvement in Theta JA when slug soldered to board
Highly conductive copper heatslug and leadframes
Optional PSOP assembly materials for enhanced power capability include soft solder
die attach
•
Available in:
PSOP 2
(.150" body) - 8, 16 lead
(.300" body) - 16, 20, 24, 28 lead
(11 x 15.9 mm body) - 20, 24, 30, 36, 44 lead
(.150" body) - 16, 28 lead
PSOP 3
PSSOP
®
PowerSOP Packages:
(PSOP / PSSOP)
Single Layer PCB
Theta JA (°C/W) by Velocity (LFPM)
Thermal Resistance:
g
Body
Size
Pad
Size
0
200
500
This Amkor-developed family of power IC
packages significantly increases the thermal
efficiency of power constrained standard SOIC
packages. The PowerSOP© (PSOP) improves
Theta JA up to 50% over a standard SOIC
thereby expanding the margin of operating
parameters. The large integrated exposed
copper heatslug to which the IC chip is direct-
ly attached results in an increased ability to
dissipate heat. The leadframe and heatslug
are mechanically attached, leaving the leads
electrically isolated. The package is offered in
a low stand-off (.002) heatslug down ver-
sion, which is MS-012, MS-013, or MO-166
JEDEC compliant depending on the package
you choose. These flexibilities still allow
maximum thermal management by directly
soldering the slug to the PCB. Furthermore,
there are two types of PSOPs (2 and 3)
available with various features and benefits
to address different market application
needs.
Pkg
PSOP 2
8
S/NS
S/NS
S/NS
3.8 x 4.9
3.8 x 9.9
2.3 x 3.1
2.3 x 4.9
144.1/157.6 120.2/131.1 104.2/112.8
16
91.2/95.9
72.2/75.2
61.8/64.4
PSOP 3
20
11 x 15.9
7.5 x 7.9
50.8/52.4
35.7/37.6
27.8/28.8
Multi-Layer PCB
Theta JA (°C/W) by Velocity (LFPM)
Body
Size
Pad
Size
0
200
500
Pkg
PSOP 2
8
S/NS
S/NS
S/NS
3.8 x 4.9
3.8 x 9.9
2.3 x 3.1
2.3 x 4.9
51.8/95.3
30.2/51.6
45.5/86.5
25.0/45.3
42.6/80.6
23.0/42.3
16
PSOP 3
20
11 x 15.9
7.5 x 7.9
19.2/25.7
14.2/20.4
12.2/17.8
JEDEC Standard Test Boards
S - Slug Soldered to Test Board
N/S - Slug Not Soldered to Test Board
Cap(apciFta)nce (mΩ)
Body
Pad
Size
Inductance
(nH)
Resistance
Pkg
Size
Lead
Electrical:
PSOP 2
8 ld
4.9 x 3.9
3.2 x 2.3
Longest
Shortest
1.120
0.684
0.456
0.344
9.9
5.7
PSOP 3
20 ld
11 x 15.9 7.5 x 7.9
Longest
Shortest
3.130
1.540
1.990
0.604
30.6
9.42
PSSOP
16 ld
4.9 x 3.9
1.3 x 3.2
Longest
Shortest
1.510
0.885
0.367
0.243
12.8
8.36
Applications:
Increased end-application densities and
shrinking product sizes demand more from
IC packages. PSOPs give designers the
needed margin for designing and producing
high performing products such as telecom,
disk drives, pagers, wireless, CATV/RF
modules, radio, automotive/industrial and
other similar applications. GaAs, SiGe and
hi-speed silicon technologies work especially
well in PSOP packages due to added
Reliability:
IC chips are assembled in optimized package designs with proven reliable
semiconductor materials.
• High temp storage: 150 °C, 1000 hrs.
• HAST:
130 °C/85% RH, no bias, 96 hours
• Temp cycle:
-65/150 °C, 500 cycles
shielding and grounding capabilities.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
DS320G
Rev Date: 01’07
www.amkor.com
5秒后页面跳转
AO3401场效应管参数、引脚图、应用原理图
BT131可控硅参数及引脚图、工作原理详解
74LS32芯片参数、引脚图及功能真值表
全球首块英伟达H200交付 黄仁勋“送货上门”
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
