Wafer Datasheet
PMB118T045SS-255A
20A/45V(1), low VF Planar MOS barrier diode
Mechanical Data
Chip Drawing
Item
Die Size (A)
Information
2998µm
118.0 mil
113.3mil
/
Top Metal Pad Size (B)
Passivation seal (C)
Wafer Thickness (D)
Scribe Line Width (E)
Wafer Size
2878µm
/
255 µm
80 µm
10.0 mil
3.15 mil
6 inch
Top Side Metallization PMB118T045SS-255A
Ag
Back Side Metallization
Ti Ni Ag
Stored in original container, in
dry nitrogen, (6 months at an
ambient temperature of
23℃±3 ℃)
Recommended
Storage Environment
Electrical Characteristics (TJ=25℃, unless otherwise specified) (2)
Un
it
Parameter
Description
Min.
Typ.
Max.
Test Condition
VBR
VF
Reverse Breakdown Voltage
Instantaneous Forward Voltage
Reverse Leakage Current
50
-
53
0.48
90
-
V
IR =300µA
IF =20A(3)
0.55
150
V
IR
-
μA VR =45V
TJ, TSTG
Operating and Storage Temperature
-40℃ to 150℃ Max
Note:
(1) The preliminary wafer datasheet only for reference;
(2) This characteristics assumes the dies are assembled in TO-277 packages. Actual performance may degrade when assembled.
YJ does not guarantee device performance after assembly;
(3) Pulse Width tp = < 300μS, Duty Cycle <2%;
扬州扬杰电子科技股份有限公司
Yangzhou Yangjie Electronics Technology Co.,Ltd.
Yangzhou Yangjie Electronics Technology Co.,Ltd.
Rev.O 2021/07/30