是否Rohs认证: | 不符合 | 生命周期: | Active |
包装说明: | BGA, BGA324,22X22,40 | Reach Compliance Code: | unknown |
风险等级: | 5.44 | JESD-30 代码: | S-PBGA-B324 |
端子数量: | 324 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA324,22X22,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
电源: | 1.8,3.3 V | 认证状态: | Not Qualified |
子类别: | ATM/SONET/SDH ICs | 最大压摆率: | 500 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
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