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PM75RLA060_05 PDF预览

PM75RLA060_05

更新时间: 2022-11-25 10:47:11
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
9页 127K
描述
FLAT-BASE TYPE INSULATED PACKAGE

PM75RLA060_05 数据手册

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MITSUBISHI <INTELLIGENT POWER MODULES>  
PM75RLA060  
FLAT-BASE TYPE  
INSULATED PACKAGE  
FEATURE  
PM75RLA060  
a) Adopting new 5th generation IGBT (CSTBT) chip, which  
performance is improved by 1µm fine rule process.  
For example, typical Vce(sat)=1.5V @Tj=125°C  
b) I adopt the over-temperature conservation by Tj detection of  
CSTBT chip, and error output is possible from all each con-  
servation upper and lower arm of IPM.  
c) New small package  
Reduce the package size by 10%, thickness by 22% from  
S-DASH series.  
d) Current rating of brake part increased.  
67% for the current rating of inverter part.  
• 3φ 75A, 600V Current-sense IGBT type inverter  
• 50A, 600V Current-sense regenerative brake IGBT  
• Monolithic gate drive & protection logic  
• Detection, protection & status indication circuits for, short-  
circuit, over-temperature & under-voltage (P-Fo available  
from upper arm devices)  
• Acoustic noise-less 5.5kW/7.5kW class inverter application  
• UL Recognized  
Yellow Card No.E80276(N)  
File No.E80271  
APPLICATION  
General purpose inverter, servo drives and other motor controls  
PACKAGE OUTLINES  
Dimensions in mm  
11  
120  
106  
7
3.25  
16  
19.75  
16  
16  
16  
15.25  
6-2  
2-φ5.5  
3
19.75  
3-2  
3-2  
3-2  
MOUNTING HOLES  
1
5
9
13  
19  
B
U
V
W
6-M5 NUTS  
22 +–  
1
10.75  
12  
0.5  
32.75  
23  
23  
23  
Terminal code  
1. VUPC 11. WP  
19-0.5  
2. UFO  
3. UP  
12. VWP1  
13. VNC  
4. VUP1 14. VN1  
5. VVPC 15. Br  
6. VFO  
7. VP  
16. UN  
17. VN  
8. VVP1 18. WN  
9. VWPC 19. Fo  
10. WFO  
May 2005  

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