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PM75B5LB060_11 PDF预览

PM75B5LB060_11

更新时间: 2024-11-18 12:23:11
品牌 Logo 应用领域
三菱 - MITSUBISHI /
页数 文件大小 规格书
10页 176K
描述
FLAT-BASE TYPE INSULATED PACKAGE

PM75B5LB060_11 数据手册

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MITSUBISHI <INTELLIGENT POWER MODULES>  
PM75B5LB060  
FLAT-BASE TYPE  
INSULATED PACKAGE  
PM75B5LB060  
FEATURE  
a) Adopting new 5th generation IGBT (CSTBTTM) chip, which  
performance is improved by 1µm fine rule process.  
For example, typical Vce(sat)=1.55V @Tj=125°C  
b) Over-temperature protection by detecting Tj of the CSTBTTM  
chips and error output is possible from all each conserva-  
tion upper and lower arm of IPM.  
c) New small package  
Reduce the package size by 10%, thickness by 22% from  
S-DASH series.  
• 2φ 75A, 600V Current-sense IGBT type inverter  
• 75A, 600V Current-sense Chopper IGBT  
• Monolithic gate drive & protection logic  
• Detection, protection & status indication circuits for, short-  
circuit, over-temperature & under-voltage (P-Fo available  
from upper arm devices)  
• UL Recognized Yellow Card No.E80276(N)  
File No.E80271  
APPLICATION  
Photo voltaic power conditioner  
PACKAGE OUTLINES  
Dimensions in mm  
L A B E L  
120  
106 0.25  
66.5  
7
19.75  
3.25  
17  
16  
3-2  
16  
16  
3-2  
15.25  
6-2  
16  
2-φ5.5  
3-2  
MOUNTING HOLES  
1.5  
3
1
5
9
13  
19  
B
U
V
W
9.5  
4
4
4
4
4
4
4 4  
2.5  
19.5  
22  
Terminal code  
23  
23  
98.25  
23  
1. VUPC 11. NC  
7.75  
2. UFO  
3. UP  
12. NC  
13. VNC  
19-0.5  
4. VUP1 14. VN1  
5. VVPC 15. NC  
6. VFO  
7. VP  
16. UN  
17. VN  
8. VVP1 18. WN  
9. NC  
19. Fo  
10. NC  
Oct. 2005  

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