Datasheet > PM75B4LB060_11

PM75B4LB060_11

更新时间： 2024-11-20 12:23:11

品牌	Logo	应用领域
三菱 - MITSUBISHI		/
页数	文件大小	规格书
8页	147K
描述
FLAT-BASE TYPE INSULATED PACKAGE

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数据手册

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PM75B4LB060_11 数据手册

MITSUBISHI <INTELLIGENT POWER MODULES>

PM75B4LB060

FLAT-BASE TYPE

INSULATED PACKAGE

PM75B4LB060

FEATURE

a) Adopting new 5th generation IGBT (CSTBT^TM) chip, which

performance is improved by 1µm fine rule process.

For example, typical Vce(sat)=1.55V @Tj=125°C

b) Over-temperature protection by detecting Tj of the CSTBT^TM

chips and error output is possible from all each conserva-

tion upper and lower arm of IPM.

c) New small package

Reduce the package size by 10%, thickness by 22% from

S-DASH series.

• 2φ 75A, 600V Current-sense IGBT type inverter

• Monolithic gate drive & protection logic

• Detection, protection & status indication circuits for, short-

circuit, over-temperature & under-voltage (P-Fo available

from upper arm devices)

• UL Recognized Yellow Card No.E80276(N)

File No.E80271

APPLICATION

Photo voltaic power conditioner

PACKAGE OUTLINES

Dimensions in mm

L A B E L

120

106 0.25

66.5

19.75

3.25

3-2

15.25

6-2

2-φ5.5

3-2

MOUNTING HOLES

1.5

9.5

4 4

2.5

19.5

Terminal code

98.25

1. VUPC 11. NC

7.75

2. UFO

3. UP

12. NC

13. VNC

19-■0.5

4. VUP1 14. VN1

5. VVPC 15. NC

6. VFO

7. VP

16. UN

17. VN

8. VVP1 18. NC

9. NC

19. Fo

10. NC

Oct. 2005

12 3 4 5 6 7 8

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