是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | 35 X 35 MM, 1.51 MM HEIGHT, SBGA-352 | Reach Compliance Code: | compliant |
风险等级: | 5.77 | 其他特性: | ALSO OPERATES AT 3.3V SUPPLY |
地址总线宽度: | 32 | 边界扫描: | YES |
总线兼容性: | PCI | 最大时钟频率: | 66 MHz |
通信协议: | SYNC, HDLC | 最大数据传输速率: | 19.5 MBps |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B352 |
JESD-609代码: | e1 | 长度: | 35 mm |
低功率模式: | NO | 湿度敏感等级: | 3 |
串行 I/O 数: | 3 | 端子数量: | 352 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.7 mm | 最大供电电压: | 2.7 V |
最小供电电压: | 2.3 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 35 mm | uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Base Number Matches: | 1 |
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